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    LOW-DIELECTRIC RESIN COMPOSITION, LOW-DIELECTRIC RESIN/METAL COMPOSITE MATERIAL AND PREPARATION METHOD THEREOF, AND ELECTRONIC EQUIPMENT
    2.
    发明申请
    LOW-DIELECTRIC RESIN COMPOSITION, LOW-DIELECTRIC RESIN/METAL COMPOSITE MATERIAL AND PREPARATION METHOD THEREOF, AND ELECTRONIC EQUIPMENT 审中-公开

    公开(公告)号：US20200224030A1

    公开(公告)日：2020-07-16

    申请号：US16608649

    申请日：2018-03-28

    Applicant: BYD COMPANY LIMITED

    Inventor： Qing GONG ,  Wei ZHOU ,  Xiong ZHANG ,  Yue YU ,  Renlan SHI

    IPC: C08L81/02 ,  B32B15/09 ,  B29C45/14 ,  C08L67/02

    Abstract: The present invention discloses a low-dielectric resin composition, a low-dielectric resin/metal composite material and a preparation method thereof, and an electronic device. The resin composition comprises, based on 100% by weight of the resin composition: 45-70 wt % of a base resin, 20-45 wt % of a chopped glass fiber, 1-3 wt % of a toughening resin, 0.2-0.5 wt % of an unmodified glycidyl methacrylate, and 0-10 wt % of an auxiliary. The base resin is selected from the PBT resin and/or the PPS resin. The chopped glass fiber has a dielectric constant of 4.0 to 4.4 at 1 MHz. With the same base resin component, the dielectric constant and dielectric loss of the low-dielectric resin material prepared with the low-dielectric resin composition are significantly reduced, which is advantageous for satisfying the requirements of use of plastics for antenna channels in metal shell of an electronic device, so as to improve the ability of the electronic device having antennas to receive and transmit signals.

    LIQUID OPTICAL SILICONE COMPOSITION, OPTICAL SILICONE, DOUBLE-GLASS PHOTOVOLTAIC ASSEMBLY, AND PREPARATION METHOD THEREFOR
    6.
    发明申请
    LIQUID OPTICAL SILICONE COMPOSITION, OPTICAL SILICONE, DOUBLE-GLASS PHOTOVOLTAIC ASSEMBLY, AND PREPARATION METHOD THEREFOR 审中-公开

    公开(公告)号：US20190322809A1

    公开(公告)日：2019-10-24

    申请号：US16475028

    申请日：2017-12-08

    Applicant: BYD COMPANY LIMITED

    Inventor： Shouping BAI ,  Wei ZHOU ,  Xiaokang DAI ,  Zhenwei LI ,  Tingting HU

    IPC: C08G77/20 ,  C08G77/12 ,  C08G77/00 ,  C08G77/08 ,  C08L83/10 ,  H01L31/048

    Abstract: The present disclosure relates to the field of silica gel, and discloses a liquid optical silica gel composition, optical silica gel, a double-glazed photovoltaic assembly and a fabrication method of the optical silica gel. The present disclosure discloses a liquid optical silica gel composition. The composition contains vinyl silicone oil, hydrogen-containing silicone oil, hydrogen-containing MQ silicone resin, a catalyst, an inhibitor and a tackifier. The weight ratio between the vinyl silicone oil, the hydrogen-containing silicone oil, the hydrogen-containing MQ silicone resin and the tackifier is 1:(0.001-0.1):(0.0001-0.08):(0.001-0.05). The hydrogen-containing silicone oil contains first hydrogen-containing silicone oil and second hydrogen-containing silicone oil. The first hydrogen-containing silicone oil has a hydrogen content of 0.1 to 1 percent by weight. The second hydrogen-containing silicone oil has a hydrogen content of 0.01 to 0.1 percent by weight. The hydrogen-containing MQ silicone resin has a hydrogen content less than 1 percent by weight.

    SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR
    8.
    发明公开
    SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR 审中-公开

    公开(公告)号：US20240011678A1

    公开(公告)日：2024-01-11

    申请号：US18002235

    申请日：2021-06-07

    Applicant: BYD COMPANY LIMITED

    Inventor： Yonghui LI ,  Junqiao LI ,  Wei ZHOU

    IPC: F25B21/02 ,  H01L23/38 ,  H10N19/00

    CPC classification number: F25B21/02 ,  H01L23/38 ,  H10N19/00

    Abstract: A semiconductor refrigeration chip and a method for manufacturing same are provided. The method includes: providing a semiconductor refrigeration assembly, where the semiconductor refrigeration assembly includes a first insulating and heat-conducting layer and a second insulating and heat-conducting layer provided opposite to each other and a semiconductor layer arranged between the first insulating and heat-conducting layer and the second insulating and heat-conducting layer, a side of the semiconductor refrigeration assembly provided with the first insulating and heat-conducting layer is a cold end, and a side of the semiconductor refrigeration assembly provided with the second insulating and heat-conducting layer is a hot end; and forming a packaging structure, and causing the packaging structure to cover a side wall of the semiconductor refrigeration assembly and define a first groove with the first insulating and heat-conducting layer, to obtain the semiconductor refrigeration chip.

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