公开(公告)号：WO2006138667A3

公开(公告)日：2007-08-30

申请号：PCT/US2006023655

申请日：2006-06-16

Applicant: CTS CORP

Inventor： KNECHT THOMAS ,  FOX ANDREW

IPC: H05K1/14 ,  H04B1/08 ,  H04B1/38 ,  H05K3/36 ,  H05K9/00

CPC classification number: H05K1/141 ,  H04B1/03 ,  H04B1/08 ,  H04B1/18 ,  H04B1/40 ,  H05K1/0237 ,  H05K3/3442 ,  H05K3/403 ,  H05K9/0026 ,  H05K2201/09181 ,  H05K2201/10371

Abstract: An RF module (20) adapted for direct surface mounting to the front end of a picocell or microcell . The module includes a circuit board (22) with a plurality of electrical components mounted thereon and defining respective RF signal transmit and receive sections. The signal transmit section is defined by at least a transmit bandpass filter (25) , a power amplifier (26) , an isolator (28) , a coupler (30) , and a duplexer (34) . The signal receive section is defined by at least the duplexer (34) , a receive low pass filter (36) , a low-noise amplifier (39) , and a receive bandpass filter (40) . A lid (45) covers selected ones of the electrical components except for at least the power amplifier. Through-holes (136) in the circuit board below the power amplifier allow for the transfer of heat from the power amplifier.

Abstract translation: 适于直接表面安装到微微小区或微小区的前端的RF模块（20）。 该模块包括其上安装有多个电气部件并且限定相应的RF信号发射和接收部分的电路板（22）。 信号发射部分至少由发射带通滤波器（25），功率放大器（26），隔离器（28），耦合器（30）和双工器（34）定义。 信号接收部分由至少双工器（34），接收低通滤波器（36），低噪声放大器（39）和接收带通滤波器（40）来定义。 除了至少功率放大器之外，盖（45）覆盖选择的电气部件。 功率放大器下面的电路板中的通孔（136）允许从功率放大器传递热量。