公开(公告)号：EP3006419A4

公开(公告)日：2017-03-22

申请号：EP14807434

申请日：2014-06-02

Applicant: DENKA COMPANY LTD

Inventor： IKARASHI KOKI ,  NONAKA SHUHEI ,  MITSUNAGA TOSHIKATSU ,  HIROTSURU HIDEKI ,  SHIIBA MITSURU

IPC: C04B35/583 ,  C04B38/00 ,  C04B41/83 ,  H01L23/15 ,  H01L23/373 ,  H05K1/03

CPC classification number: C04B41/84 ,  C04B35/583 ,  C04B41/009 ,  C04B41/48 ,  C04B41/4853 ,  C04B41/4905 ,  C04B41/4961 ,  C04B41/83 ,  C04B2111/00844 ,  C04B2235/3208 ,  C04B2235/386 ,  C04B2235/3895 ,  C04B2235/5292 ,  C04B2235/5436 ,  C04B2235/5472 ,  C04B2235/787 ,  C04B2235/9607 ,  H01L23/145 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0209 ,  H01L2924/00 ,  C04B38/00

Abstract: A resin-impregnated boron nitride sintered body having superior thermal conductivity and superior strength, and a resin-impregnated boron nitride sintered body having superior conductivity and small anisotropy of thermal conductivity are provided. A resin-impregnated boron nitride sintered body, including: 30 to 90 volume% of a boron nitride sintered body having boron nitride particles bonded three-dimensionally; and 10 to 70 volume% of a resin; wherein the boron nitride sintered body has a porosity of 10 to 70%; the boron nitride particles of the boron nitride sintered body has an average long diameter of 10µm or more; the boron nitride sintered body has a graphitization index by powder X-ray diffractometry is 4.0 or less; and an orientation degree of the boron nitride particles of the boron nitride sintered body by I.O.P is 0.01 to 0.05 or 20 to 100; and a resin-impregnated boron nitride sintered body, including: 30 to 90 volume% of a boron nitride sintered body having boron nitride particles bonded three-dimensionally; and 10 to 70 volume% of a resin; wherein: the boron nitride sintered body has a calcium content of 500 to 5000ppm; the boron nitride sintered body has a graphitization index by powder X-ray diffractometry of 0.8 to 4.0; the boron nitride sintered body comprises flake-like boron nitride particles having an average long diameter of 10µm or more; and an orientation degree by I.O.P is 0.6 to 1.4; are provided.

公开(公告)号：EP3035778A4

公开(公告)日：2017-01-11

申请号：EP14836058

申请日：2014-08-12

Applicant: DENKA COMPANY LTD

Inventor： HIROTSURU HIDEKI ,  NONAKA SHUHEI ,  MITSUNAGA TOSHIKATSU ,  IKARASHI KOKI ,  MIYATA KOUJI ,  NISHI TAIKI ,  INOUE SAORI ,  KOBAYASHI FUMIYA

IPC: H05K1/03 ,  C04B35/583 ,  C04B41/83 ,  H05K1/02

CPC classification number: H05K1/0271 ,  C08K7/00 ,  C08K2003/385 ,  C08K2201/004 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/022 ,  H05K3/38 ,  H05K2201/0104 ,  H05K2201/066

Abstract: A boron nitride/resin composite circuit board having high heat dissipation characteristics and high relyability is provided. A boron nitride/resin composite circuit board, including: a plate-shaped resin-impregnated boron nitride sintered body having a plate thickness of 0.2 to 1.5mm, the plate-shaped resin-impregnated boron nitride sintered body including 30 to 85 volume% of a boron nitride sintered body having boron nitride particles bonded three-dimensionally, the boron nitride particles having an average long diameter of 5 to 50µm, and 70 to 15 volume% of a resin; and a metal circuit adhered onto both principal planes of the plate-shaped resin-impregnated boron nitride sintered body, the metal circuit being copper or aluminum, wherein: a ratio of a linear thermal expansion coefficient in a plane direction of the resin-impregnated boron nitride sintered body at 40 to 150°C (CTE1) and a linear thermal expansion coefficient of the metal circuit at 40 to 150°C (CTE2) (CTE1/CTE2) is 0.5 to 2.0.

Abstract translation: 提供一种具有高散热特性与高relyability氮化硼/树脂复合电路板。 氮化硼/树脂复合电路板，包括：具有0.2的板厚度至1.5mm的板状的树脂浸渍晶氮化硼烧结体，板形树脂浸渍晶氮化硼烧结体包含30〜85体积％ 一个具有氮化硼烧结体氮化硼颗粒结合三维，具有上的5至50微米，和树脂的70〜15体积％的平均长径氮化硼颗粒; 和粘附到所述板形树脂浸渍氮化硼烧结体的两主面的金属电路，所述金属电路为铜或铝，worin：一个线性热膨胀系数的树脂浸渍的硼的平面方向的比 氮化物烧结体在40至150℃（CTE1）和金属电路的在40的线性热膨胀系数，以150℃（CTE 2）（CTE1 / CTE2）为0.5〜2.0。