公开(公告)号：US20200373469A1

公开(公告)日：2020-11-26

申请号：US16882412

申请日：2020-05-22

Applicant: EPISTAR CORPORATION ,  Yenrich Technology Corporation

Inventor： Shau-Yi CHEN ,  Tzu-Yuan LIN ,  Wei-Chiang HU ,  Pei-Hsuan LAN ,  Min-Hsun HSIEH

IPC: H01L33/58 ,  H01L27/15 ,  H01L33/62

Abstract: A package includes a substrate, a first light-emitting unit, a second light-emitting unit, a light-transmitting layer, and a light-absorbing layer. The substrate has a first surface and an upper conductive layer on the first surface. The first light-emitting unit and the second light-emitting unit are disposed on the upper conductive layer. The first light-emitting unit has a first light-emitting surface and a first side wall. The second light-emitting unit has a second light-emitting surface and a second side wall. The light-transmitting layer is disposed on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit. The light-absorbing layer is disposed between the substrate and the light-transmitting layer, covers the upper conductive layer, the first side wall, and the second side wall, and exposes the first light-emitting surface and the second light-emitting surface.

公开(公告)号：US20200373468A1

公开(公告)日：2020-11-26

申请号：US16990121

申请日：2020-08-11

Applicant: EPISTAR CORPORATION

Inventor： Ching-Tai CHENG ,  Shau-Yi CHEN ,  Yih-Hua RENN ,  Wei-Shan HU ,  Pei-Hsuan LAN

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/44 ,  H01L33/60

Abstract: The application discloses a light-emitting device including a carrier, a light-emitting element and a connecting structure. The carrier includes a first connecting portion and a first necking portion extended from the first connecting portion. The first connecting portion has a first width, and the first necking portion has a second width. The second width is less than the first width. The light-emitting element includes a first light-emitting layer being able to emit a first light and a first contacting electrode formed under the first light-emitting layer. The first contacting electrode is corresponded to the first connecting portion. The connecting structure includes a first electrical connecting portion and a protecting portion surrounding the first electrical connecting portion. The first electrical connecting portion is electrically connected to the first connecting portion and the first contacting electrode. The first connecting portion substantially is located within a range surrounded by the protecting portion.

公开(公告)号：US20240145650A1

公开(公告)日：2024-05-02

申请号：US18407075

申请日：2024-01-08

Applicant: EPISTAR CORPORATION ,  Yenrich Technology Corporation

Inventor： Shau-Yi CHEN ,  Tzu-Yuan LIN ,  Wei-Chiang HU ,  Pei-Hsuan LAN ,  Min-Hsun HSIEH

IPC: H01L33/58 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L33/58 ,  H01L27/156 ,  H01L33/62

Abstract: A package comprises a substrate including a first surface, and an upper conductive layer arranged on the first surface, a first light-emitting unit arranged on the upper conductive layer, and comprises a first semiconductor layer, a first substrate, a first light-emitting surface and a first side wall, a second light-emitting unit, which is arranged on the upper conductive layer, and comprises a second light-emitting surface and a second side wall, a light-transmitting layer arranged on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit, a light-absorbing layer, which is arranged between the substrate and the light-transmitting layer in a continuous configuration of separating the first light-emitting unit and the second light-emitting unit from each other, and a reflective wall arranged on the first side wall, wherein a height of the reflective wall is lower than that of the light-absorbing layer.

公开(公告)号：US20230034763A1

公开(公告)日：2023-02-02

申请号：US17967681

申请日：2022-10-17

Applicant: EPISTAR CORPORATION ,  Yenrich Technology Corporation

Inventor： Shau-Yi CHEN ,  Tzu-Yuan LIN ,  Wei-Chiang HU ,  Pei-Hsuan LAN ,  Min-Hsun HSIEH

IPC: H01L33/58 ,  H01L27/15 ,  H01L33/62

Abstract: A package includes a substrate, a first light-emitting unit, a second light-emitting unit, a light-transmitting layer, and a light-absorbing layer. The substrate has a first surface and an upper conductive layer on the first surface. The first light-emitting unit and the second light-emitting unit are disposed on the upper conductive layer. The first light-emitting unit has a first light-emitting surface and a first side wall. The second light-emitting unit has a second light-emitting surface and a second side wall. The light-transmitting layer is disposed on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit. The light-absorbing layer is disposed between the substrate and the light-transmitting layer, covers the upper conductive layer, the first side wall, and the second side wall, and exposes the first light-emitting surface and the second light-emitting surface.

公开(公告)号：US20210083159A1

公开(公告)日：2021-03-18

申请号：US17104330

申请日：2020-11-25

Applicant: EPISTAR CORPORATION

Inventor： Pei-Hsuan LAN ,  Ching-Tai CHENG

IPC: H01L33/60 ,  H01L33/50 ,  H01L33/62 ,  H01L33/48

Abstract: A light-emitting device includes a light-emitting element, an electrode, a reflective layer and a transparent layer. The reflective layer surrounds the light-emitting element and has an inner surface including a first portion and a second portion. There is a first angle included between the first portion and the first lateral surface, there is a second angle included between the second portion and the first lateral surface, and the first angle is larger than the second angle. The transparent layer includes an outer portion and an inner portion. The outer portion is formed above the upper surface and the inner portion is formed between the reflective layer and the first lateral surface. The outer portion includes wavelength conversion material and the inner portion does not comprise the wavelength conversion material.

公开(公告)号：US20190237637A1

公开(公告)日：2019-08-01

申请号：US16262116

申请日：2019-01-30

Applicant: EPISTAR CORPORATION

Inventor： Ching-Tai CHENG ,  Shau-Yi CHEN ,  Yih-Hua RENN ,  Wei-Shan HU ,  Pei-Hsuan LAN

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/60 ,  H01L33/44

Abstract: The application discloses a light-emitting device including a carrier, a light-emitting element and a connecting structure. The carrier includes a first connecting portion and a first necking portion extended from the first connecting portion. The first connecting portion has a first width, and the first necking portion has a second width. The second width is less than the first width. The light-emitting element includes a first light-emitting layer being able to emit a first light and a first contacting electrode formed under the first light-emitting layer. The first contacting electrode is corresponded to the first connecting portion. The connecting structure includes a first electrical connecting portion and a protecting portion surrounding the first electrical connecting portion. The first electrical connecting portion is electrically connected to the first connecting portion and the first contacting electrode. The first connecting portion substantially is located within a range surrounded by the protecting portion.