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    Microelectromechanical device with piezoelectric block and method of manufacturing the same
    1.
    发明专利
    Microelectromechanical device with piezoelectric block and method of manufacturing the same 有权
    具有压电块的微电子器件及其制造方法

    公开(公告)号：JP2012016818A

    公开(公告)日：2012-01-26

    申请号：JP2011233425

    申请日：2011-10-24

    Applicant: Fujifilm Dimatix Inc ,  フジフィルム ディマティックス, インコーポレイテッド

    Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  MENZEL CHRISTOPH ,  HOISINGTON PAUL A

    IPC: B81C3/00 ,  F04B43/04

    CPC classification number: H01L41/0973 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1629 ,  B41J2/1632 ,  H01L41/313 ,  H01L41/337 ,  H01L41/338

    Abstract: PROBLEM TO BE SOLVED: To provide a microelectromechanical system.SOLUTION: The microelectromechanical system with structures having piezoelectric actuators (104) is provided. A plurality of piezoelectric islands are supported by a body (200) having a plurality of channels (205). The piezoelectric islands can be formed, in a part of the steps, by forming cuts (145) into a thick layer of a piezoelectric material, temporarily bonding it to a handle substrate, attaching the cut piezoelectric layer (107) to the body (200) having etching formation structures, and grinding the piezoelectric layer to a thickness that is smaller than depths of the cuts (140). Conductive materials (158, 210) can be formed on the piezoelectric layer to form electrodes (106, 112).

    Abstract translation: 要解决的问题：提供微机电系统。 提供了具有压电致动器（104）的结构的微机电系统。 多个压电岛由具有多个通道（205）的主体（200）支撑。 压电岛可以在一部分步骤中通过将切口（145）形成为压电材料的厚层，暂时将其粘合到手柄基板上，将切割的压电层（107）附接到主体（200） ），并且将所述压电层研磨至比所述切口（140）的深度小的厚度。 可以在压电层上形成导电材料（158,210），以形成电极（106,112）。 版权所有（C）2012，JPO＆INPIT

    METHOD OF FORMING A DEVICE WITH A PIEZOELECTRIC TRANSDUCER
    2.
    发明专利
    METHOD OF FORMING A DEVICE WITH A PIEZOELECTRIC TRANSDUCER 未知

    公开(公告)号：HK1163345A1

    公开(公告)日：2012-09-07

    申请号：HK12103670

    申请日：2008-02-06

    Applicant: FUJIFILM DIMATIX INC

    Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  MENZEL CHRISTOPH ,  HOISINGTON PAUL A

    IPC: H01L20060101 ,  B41J20060101

    Abstract: A method of forming a microelectromechanical device with a piezoelectric transducer is described, the method comprising the steps of bonding a first surface of a body of piezoelectric material (107) to a first surface of a handle layer (135); forming alignment cuts (171) into a second surface of the body of piezoelectric material, the alignment cuts extending entirely through the body of piezoelectric material and partially into the handle layer; after forming the alignment cuts, attaching the second surface of the body of piezoelectric material to a device body; and after attaching the body of piezoelectric material to the device body, removing the handle layer from the first surface of the body of piezoelectric material.

    BONDING ON SILICON SUBSTRATE HAVING A GROOVE
    3.
    发明申请
    BONDING ON SILICON SUBSTRATE HAVING A GROOVE 审中-公开
    与具有沟槽的硅衬底结合

    公开(公告)号：WO2010033774A3

    公开(公告)日：2010-06-03

    申请号：PCT/US2009057433

    申请日：2009-09-18

    Applicant: FUJIFILM DIMATIX INC ,  MENZEL CHRISTOPH ,  DEBRABANDER GREGORY ,  NISTORICA CORINA

    Inventor： MENZEL CHRISTOPH ,  DEBRABANDER GREGORY ,  NISTORICA CORINA

    IPC: H01L21/60 ,  H01L41/053 ,  H01L41/22

    CPC classification number: H01L41/0973 ,  H01L41/313 ,  Y10T29/42 ,  Y10T156/10

    Abstract: A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a membrane surface, a groove in the membrane surface, a transducer having a transducer surface substantially parallel to the membrane surface, and an adhesive connecting the membrane surface to the transducer surface. The groove can be configured to permit flow of adhesive into and through the groove while minimizing voids or air gaps that could result from incomplete filling of the groove. Multiple grooves can be formed in the membrane surface and can be of uniform depth.

    Abstract translation: 公开了一种用于在硅衬底上接合的方法和装置。 一种装置包括具有膜表面的膜，膜表面中的槽，具有基本上平行于膜表面的换能器表面的换能器以及将膜表面连接到换能器表面的粘合剂。 凹槽可以被配置为允许粘合剂流入并穿过凹槽，同时最小化由于凹槽不完全填充可能导致的空隙或气隙。 可以在膜表面形成多个凹槽并且可以具有均匀的深度。

    5.
    发明专利
    未知

    公开(公告)号：AT545159T

    公开(公告)日：2012-02-15

    申请号：AT05806986

    申请日：2005-10-11

    Applicant: FUJIFILM DIMATIX INC

    Inventor： BIBL ANDREAS ,  HIGGINSON JOHN ,  MENZEL CHRISTOPH ,  HOISINGTON PAUL

    IPC: H01L41/09 ,  B41J2/14 ,  B41J2/16 ,  H01L41/22

    Abstract: A method of forming a microelectromechanical device with a piezoelectric transducer is described, the method comprising the steps of bonding a first surface of a body of piezoelectric material (107) to a first surface of a handle layer (135); forming alignment cuts (171) into a second surface of the body of piezoelectric material, the alignment cuts extending entirely through the body of piezoelectric material and partially into the handle layer; after forming the alignment cuts, attaching the second surface of the body of piezoelectric material to a device body; and after attaching the body of piezoelectric material to the device body, removing the handle layer from the first surface of the body of piezoelectric material.

    METHOD OF FORMING A DEVICE WITH A PIEZOELECTRIC TRANSDUCER
    6.
    发明专利
    METHOD OF FORMING A DEVICE WITH A PIEZOELECTRIC TRANSDUCER 未知

    公开(公告)号：HK1107873A1

    公开(公告)日：2008-04-18

    申请号：HK08101478

    申请日：2008-02-06

    Applicant: FUJIFILM DIMATIX INC

    Inventor： BIBL ANDREAS ,  HIGGINSON JOHN A ,  MENZEL CHRISTOPH ,  HOISINGTON PAUL A

    IPC: B41J20060101 ,  H01L20060101

    Abstract: A method of forming a microelectromechanical device with a piezoelectric transducer is described, the method comprising the steps of bonding a first surface of a body of piezoelectric material (107) to a first surface of a handle layer (135); forming alignment cuts (171) into a second surface of the body of piezoelectric material, the alignment cuts extending entirely through the body of piezoelectric material and partially into the handle layer; after forming the alignment cuts, attaching the second surface of the body of piezoelectric material to a device body; and after attaching the body of piezoelectric material to the device body, removing the handle layer from the first surface of the body of piezoelectric material.

    IMPROVING DROP VELOCITY, MASS, AND FORMATION UNIFORMITY
    9.
    发明申请
    IMPROVING DROP VELOCITY, MASS, AND FORMATION UNIFORMITY 审中-公开
    改善流失速度，质量和形成均匀性

    公开(公告)号：WO2015105587A3

    公开(公告)日：2015-10-15

    申请号：PCT/US2014065962

    申请日：2014-11-17

    Applicant: FUJIFILM DIMATIX INC

    Inventor： PANCHAWAGH HRISHIKESH V ,  MENZEL CHRISTOPH

    IPC: B41J2/07 ,  B41J2/085 ,  B41J2/205

    CPC classification number: B41J2/04598 ,  B41J2/04525 ,  B41J2/0456 ,  B41J2/04561 ,  B41J2/04581 ,  B41J2/04588 ,  B41J2/04593 ,  B41J2/04595 ,  B41J2/04596 ,  B41J2202/12

    Abstract: Methods and systems are described herein for driving droplet ejection devices with multi-level waveforms. In one embodiment, a method for driving droplet ejection devices includes applying a multi-level waveform to the droplet ejection devices. The multi-level waveform includes a first section having at least one compensating edge and a second section having at least one drive pulse. The compensating edge has a compensating effect on systematic variation in droplet velocity or droplet mass across the droplet ejection devices. In another embodiment, the compensating edge has a compensating effect on cross-talk between the droplet ejection devices.

    Abstract translation: 本文描述了用于驱动具有多电平波形的液滴喷射装置的方法和系统。 在一个实施例中，用于驱动液滴喷射装置的方法包括将多级波形施加到液滴喷射装置。 多电平波形包括具有至少一个补偿边缘的第一部分和具有至少一个驱动脉冲的第二部分。 补偿边缘对液滴喷射装置上的液滴速度或液滴质量的系统变化具有补偿作用。 在另一个实施例中，补偿边缘对液滴喷射装置之间的串扰有补偿作用。

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