2.
    发明专利
    未知

    公开(公告)号:AT33686T

    公开(公告)日:1988-05-15

    申请号:AT82111441

    申请日:1982-12-10

    Applicant: IBM

    Abstract: A process for electroplating chromium comprising pre-treating the surface of a part to be plated with chromium by forming a deposit of a sulphur compound thereon, which sulphur compound accelerates the reduction of chromium ions to chromium metal. Preferably the deposit is formed cathodically in a solution containing a sulphur species. The sulphur species include thiocyanate, or species having S-O or S-S bonds: or a species having a -C=S or -C-S group within the molecule. Alternatively the sulphur compound can be chemically deposited by evaporating sulphur on to the surface or by immersing the part in a solution of sulphide ions.

    ELECTRODEPOSITION OF CHROMIUM AND ITS ALLOYS

    公开(公告)号:DE3269232D1

    公开(公告)日:1986-03-27

    申请号:DE3269232

    申请日:1982-11-11

    Applicant: IBM

    Abstract: A chromium electroplating electrolyte comprising a source of trivalent chromium ions, a complexant, a buffer agent and a sulphur species selected from sulphites and dithionites, the complexant being selected so that the stability constant K1 of the chromium complex as defined herein is in the range 10 M preferably the chromium ions have a molar concentration lower than 0.01M. Complexants within this range include aspartic acid, iminodiacetic acid, nitrilotriacetic acid, 5-sulphosalicylic acid and citric acid.

    ELECTRODEPOSITION OF CHROMIUM
    4.
    发明专利

    公开(公告)号:GB2109817B

    公开(公告)日:1985-07-03

    申请号:GB8134779

    申请日:1981-11-18

    Applicant: IBM

    Abstract: A chromium electroplating electrolyte comprising a source of trivalent chromium ions, a complexant, a buffer agent and a sulphur species selected from sulphites and dithionites, the complexant being selected so that the stability constant K1 of the chromium complex as defined herein is in the range 10 M preferably the chromium ions have a molar concentration lower than 0.01M. Complexants within this range include aspartic acid, iminodiacetic acid, nitrilotriacetic acid, 5-sulphosalicylic acid and citric acid.

    ELECTRODEPOSITION OF CHROMIUM AND ITS ALLOYS

    公开(公告)号:ZA828368B

    公开(公告)日:1983-09-28

    申请号:ZA828368

    申请日:1982-11-15

    Applicant: IBM

    Abstract: A chromium electroplating electrolyte containing trivalent chromium ions, a complexant, a buffer agent and thiocyanate ions for promoting chromium deposition, the thiocyanate having a molar concentration lower than that of the chromium ions. The chromium preferably has a concentration lower than 0.01M. Preferably the complexant is selected so that the stability constant K1 of chromium complex is in the range 10 M . Complexants in this range include aspartic acid, iminodiacetic acid, nitrilotriacetic acid and 5-sulphosalicylic acid.

    ELECTROPLATING CHROMIUM
    9.
    发明专利

    公开(公告)号:GB2115008A

    公开(公告)日:1983-09-01

    申请号:GB8302296

    申请日:1983-01-27

    Applicant: IBM

    Abstract: A process for electroplating chromium comprising pre-treating the surface of a part to be plated with chromium by forming a deposit of a sulphur compound thereon, which sulphur compound accelerates the reduction of chromium ions to chromium metal. Preferably the deposit is formed cathodically in a solution containing a sulphur species. The sulphur species include thiocyanate, or species having S-O or S-S bonds: or a species having a -C=S or -C-S group within the molecule. Alternatively the sulphur compound can be chemically deposited by evaporating sulphur on to the surface or by immersing the part in a solution of sulphide ions.

Patent Agency Ranking