公开(公告)号：JP2002180299A

公开(公告)日：2002-06-26

申请号：JP2001323511

申请日：2001-10-22

Applicant: IBM

Inventor： LISA A FANTI ,  JOHN MICHAEL COTT ,  DAVID ELI AIKUSUTATTO

IPC: C23F1/18 ,  C23F1/28 ,  C23F1/34 ,  C23F1/40 ,  C25F3/02 ,  C25F3/14 ,  H01L21/3063 ,  H01L21/3213 ,  H01L21/60 ,  H01L23/485

Abstract: PROBLEM TO BE SOLVED: To subject a substrate containing a metal which is to undergo electroetching and a high Sn solder bumps which do not undergo etching to electroetching. SOLUTION: Electroetching is performed by using a water-based electrochemical etching solution for subjecting metal to etching in the presence of one or several kinds of metals which do not undergo etching. The etching solution contains glyceline having concentration in the range of 1.30 to 1.70 M, a sulfate compound having the concentration of sulfuric ions in the range of 0 to 0.5 M and a phosphate compound having the concentration of phosphoric ions in the range of 0.1 to 0.5 M. In this way, the solder bumps which do not undergo etching are protected and left, and the metal to be etched is removed without leaving residues.