1.
    发明专利
    未知

    公开(公告)号:DE69024704D1

    公开(公告)日:1996-02-22

    申请号:DE69024704

    申请日:1990-04-27

    Applicant: IBM

    Abstract: A method of assembling a multilayer laminate interconnection board, particularly boards in which each layer preferably includes copper conductors (16) on polyimide film layers (14), involves adhesively joining individual layers of wired film initially onto an auxiliary pin carrier substrate (20) and then onto a previously laminated layer. After each layer is aligned and adhesively joined to the immediately preceeding layer, holes are formed through the layer. Metal is deposited into the holes for electrically connecting conductors on the top surface of the last layer to a via located on the immediately preceeding layer. The process is repeated for each layer of the multilayer laminate interconnection board until the entire board is completely assembled. Alternatively, layers containing preformed and metalized holes at the location of a respective via in a particular layer are aligned and adhesively laminated.

    2.
    发明专利
    未知

    公开(公告)号:DE69024704T2

    公开(公告)日:1996-07-04

    申请号:DE69024704

    申请日:1990-04-27

    Applicant: IBM

    Abstract: A method of assembling a multilayer laminate interconnection board, particularly boards in which each layer preferably includes copper conductors (16) on polyimide film layers (14), involves adhesively joining individual layers of wired film initially onto an auxiliary pin carrier substrate (20) and then onto a previously laminated layer. After each layer is aligned and adhesively joined to the immediately preceeding layer, holes are formed through the layer. Metal is deposited into the holes for electrically connecting conductors on the top surface of the last layer to a via located on the immediately preceeding layer. The process is repeated for each layer of the multilayer laminate interconnection board until the entire board is completely assembled. Alternatively, layers containing preformed and metalized holes at the location of a respective via in a particular layer are aligned and adhesively laminated.

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