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公开(公告)号:JPS62170085A
公开(公告)日:1987-07-27
申请号:JP24332486
申请日:1986-10-15
Applicant: IBM
Inventor: WANG SHERMAN SHEAU-MING , DISTEFANO THOMAS HERMAN , HOLLIS JR , JOHNSON MARK
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公开(公告)号:DE3585470D1
公开(公告)日:1992-04-09
申请号:DE3585470
申请日:1985-07-01
Applicant: IBM
Inventor: DISTEFANO THOMAS HERMAN , BAKOGLU HALIL BURHAN
IPC: G01B11/00 , B01J21/08 , B01J23/28 , B01J23/30 , G11B5/596 , G11B21/10 , H01L31/0232 , H01L31/173 , G11B21/00
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公开(公告)号:DE2719505A1
公开(公告)日:1977-12-08
申请号:DE2719505
申请日:1977-05-02
Applicant: IBM
Inventor: DISTEFANO THOMAS HERMAN
Abstract: The practice of this invention provides display of information which utilizes the inherent characteristic of the displacement by an applied electric field intensity distribution of the interface between two fluid dielectric media which are operationally immiscible in each other and have different total dielectric properties at the interface. In particular, the information handling and display in the practice of this invention are with an optical display device in which the two dielectric media are immiscible liquids, e.g., oil and water. The local displacement of the interface therebetween is accomplished by the local application of an electric field which effects movement of the interface by electrohydrodynamic interaction with the dielectric media at the interface. An embodiment of the invention includes an electrode structure for applying an electric field intensity distribution so that the interface can be displaced locally and selectively and preferentially in accordance with a particular information pattern.
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公开(公告)号:FI67267C
公开(公告)日:1985-02-11
申请号:FI772634
申请日:1977-09-06
Applicant: IBM
Inventor: CUOMO JEROME JOHN , DISTEFANO THOMAS HERMAN , WOODALL JERRY MACPHERSON
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公开(公告)号:NO773128L
公开(公告)日:1978-03-17
申请号:NO773128
申请日:1977-09-09
Applicant: IBM
Inventor: CUOMO JEROME JOHN , DISTEFANO THOMAS HERMAN , WOODALL JERRY MACPHERSON
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公开(公告)号:DE2363088A1
公开(公告)日:1974-07-11
申请号:DE2363088
申请日:1973-12-19
Applicant: IBM
Inventor: DISTEFANO THOMAS HERMAN , LAIBOWITZ ROBERT BENJAMIN , ROSENBERG ROBERT
Abstract: The present invention relates to electrodes used for charging electrophotographic image surfaces in copying machines. More particularly, the disclosure is directed to the negative corona discharge electrodes which produce a negative charge that is applied to the photoconductive surface exposed to the corona discharge. In the present invention, the electrode structure includes a combination of a wire of valve metal with a high resistivity coating spread uniformly over the surface of the wire. The valve metal, one example being tantalum, may serve as the electrode wire itself or may surround an inner wire such as stainless steel. By providing an electrode for corona discharge having a uniform high resistive coating, the plasma glow produced will spread uniformly along the length of the wire. By using a valve metal, which forms a hard oxide under the high resistivity coating, the electrode is self-healing in that if cracks or imperfections occur in the coating, the exposed valve metal will oxidize and fill in the cracks and imperfections.
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公开(公告)号:DE2329571A1
公开(公告)日:1974-01-10
申请号:DE2329571
申请日:1973-06-09
Applicant: IBM
Inventor: ARGYLE BERNELL EDWIN , DISTEFANO THOMAS HERMAN
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公开(公告)号:DE69024704T2
公开(公告)日:1996-07-04
申请号:DE69024704
申请日:1990-04-27
Applicant: IBM
Inventor: DISTEFANO THOMAS HERMAN , EHRENBERG SCOTT GUSTAVE
Abstract: A method of assembling a multilayer laminate interconnection board, particularly boards in which each layer preferably includes copper conductors (16) on polyimide film layers (14), involves adhesively joining individual layers of wired film initially onto an auxiliary pin carrier substrate (20) and then onto a previously laminated layer. After each layer is aligned and adhesively joined to the immediately preceeding layer, holes are formed through the layer. Metal is deposited into the holes for electrically connecting conductors on the top surface of the last layer to a via located on the immediately preceeding layer. The process is repeated for each layer of the multilayer laminate interconnection board until the entire board is completely assembled. Alternatively, layers containing preformed and metalized holes at the location of a respective via in a particular layer are aligned and adhesively laminated.
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