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1.发明公开STRUCTURES AND METHODS FOR LOW-K OR ULTRA LOW-K INTERLAYER DIELECTRIC PATTERN TRANSFER 审中-公开结构AND METHOD FOR LOW-K或超低k夹层图案转移
公开(公告)号：EP2024993A4
公开(公告)日：2011-08-10
申请号：EP07794523
申请日：2007-05-03
Applicant: IBM
Inventor： BUCCHIGNANO JAMES J , GIBSON GERALD W , ROTHWELL MARY B , YU ROY R
IPC: H01L21/768 , H01L21/311
CPC classification number: H01L21/31144 , H01L21/76802 , H01L21/76813
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