公开(公告)号：CA1292965C

公开(公告)日：1991-12-10

申请号：CA507433

申请日：1986-04-24

Applicant: IBM

Inventor： CLABES JOACHIM G ,  HAHN PETER O ,  HO PAUL S ,  LEFAKIS HARALAMBOS ,  RUBLOFF GARY W

IPC: C08J7/06 ,  C08J7/18 ,  C23C14/02 ,  C23C14/20

Abstract: Y09-85-014 A technique is described for improving metal-organic substrate adhesion and for reducing stress between the metal film and the substrate. Beams of low energy reactive ions, electrons, or photons are incident upon the substrate to alter the surface chemistry of the substrate to a depth of from about 10 angstroms to a few hundred angstroms. The energy of the incident reactive ions and electrons is about 50-2000eV, while the energy of the incident photons is about 0.2 - 500eV. Irradiation of the substrate can occur prior to or during metal deposition. For simultaneous metal deposition/particle irradiation, the arrival rates of the metal atoms and the substrate treatment particles are within a few order of magnitude of one another. Room temperature or elevated temperatures are suitable.

公开(公告)号：CA1276088C

公开(公告)日：1990-11-13

申请号：CA498399

申请日：1985-12-20

Applicant: IBM

Inventor： HO PAUL S ,  HAHN PETER O ,  LEFAKIS HARRY ,  RUBLOFF GARY W

IPC: C23C14/02 ,  C23C14/20 ,  C23C14/58 ,  H01L21/48 ,  H01L23/14 ,  H05K3/14 ,  H05K3/16 ,  H05K3/38 ,  C23C14/34 ,  B05D3/00 ,  B05D7/04

Abstract: ENHANCED ADHESION BETWEEN METALS AND POLYMERS A technique is described for increasing the adhesion between metals and organic substrates, where the metals are those which normally only very weakly bond to the substrate. These metals include Ni, Cu, Al, Ag, Au, Ta, Pt, Ir, Rh, Pd, Zn, and Cd. The organic substrates include mylar, polyimides, polyesters, plastics, polyethylene, polystyrene, etc. Enhanced adhesion occurs when intermixing, between the depositing metal atoms and the substrate is optimized to a depth less than about 1000 angstroms into the substrate. This occurs in a critical substrate temperature range of about (0.6-0.8) Tc, where Tc is the curing temperature of the substrate. The deposition rate of the metal atoms is chosen such that the arrival rate of the metal atoms at the surface of the substrate is comparable to or less than the rate of diffusion of metal atoms into the substrate. This provides optimum intermixing and maximum adhesion.