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公开(公告)号：SG78390A1
公开(公告)日：2001-02-20
申请号：SG1999004437
申请日：1999-09-09
Applicant: IBM
Inventor： STILL STEPHEN EUGENE , GARCIA RAY , HONEYCUTT KANDALL ANTHONY , TOUT JAMES J JR
Abstract: A method for monitoring the operating temperature of a semiconductor device. The method comprising the steps of: placing a thermal coupling material between the bottom of the semiconductor device and the top of a printed circuit board for inserting the device thereinto; inserting a sensor so to be at least partially covered by the thermal coupling material; and measuring the temperature from the sensor within a predetermined time interval. In accordance with another aspect of the invention, an apparatus is described to carry out the above process.
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