Thermal monitoring system for semiconductor devices

    公开(公告)号:SG78390A1

    公开(公告)日:2001-02-20

    申请号:SG1999004437

    申请日:1999-09-09

    Applicant: IBM

    Abstract: A method for monitoring the operating temperature of a semiconductor device. The method comprising the steps of: placing a thermal coupling material between the bottom of the semiconductor device and the top of a printed circuit board for inserting the device thereinto; inserting a sensor so to be at least partially covered by the thermal coupling material; and measuring the temperature from the sensor within a predetermined time interval. In accordance with another aspect of the invention, an apparatus is described to carry out the above process.

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