公开(公告)号：JPH11335573A

公开(公告)日：1999-12-07

申请号：JP2986299

申请日：1999-02-08

Applicant: IBM

Inventor： JOHANSSON GARY A ,  PAPATHOMAS KONSTANTINOS I

IPC: H05K1/03 ,  B32B15/08 ,  C08K3/00 ,  C08K5/00 ,  C08L63/00 ,  C08L79/00 ,  C08L101/00 ,  H05K1/02 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To obtain a composition useful for a dielectric layer of a circuit plate by containing a resin material, a coloring agent and a fluorescent agent. SOLUTION: A resin derivative composition is comprised of containing: preferably about 78-about 98 wt.% of a resin material selected preferably from epoxy, cyanate and bismaleimide resins; preferably about 0.01-about 10 wt.% of a coloring agent selected from an organic dye, an organic pigment and an inorganic pigment; and preferably about 0.01-about 12 wt.% of a fluorescent agent as an ultraviolet absorption compound preferably containing the ultraviolet absorption compound to strengthen a fluorescent characteristic. An epoxy contains preferably an epoxy polymer resin including an epoxide derived from a monocyclic and polycyclic divalent phenol; and a cyanate contains preferably a polyfunctional cyanate ester monomer of the formula: R-(OCN)m (wherein m is 2-5; R is an aromatic organic group and NCO is bonded to an aromatic ring) or its polymer. A defect of a circuit can be inspected optically and accurately by applying a dielectric layer containing this composition to the circuit plate.

公开(公告)号：MY119582A

公开(公告)日：2005-06-30

申请号：MYPI9900182

申请日：1999-01-15

Applicant: IBM

Inventor： JOHANSSON GARY A ,  PAPATHOMAS KONSTANTINOS I

IPC: B32B3/00 ,  B32B15/08 ,  H05K1/03 ,  C08F283/00 ,  C08K3/00 ,  C08K5/00 ,  C08L63/00 ,  C08L79/00 ,  C08L101/00 ,  H05K1/00 ,  H05K1/02 ,  H05K3/46

Abstract: A COMPOSITION FOR USE IN MAKING HIGH OPTICAL CONTRAST AND UV LIGHT FLUORESCING DIELECTRIC MATERIAL USUABLE IN PRINTED CIRCUIT BOARDS, WHICH IN TURN MAY FORM PART OF AN ELECTRONIC PACKAGE. THE COMPOSITION COMPRISES A RESIN, A COLORING AGENT, AND A FLUORESCING AGENT. A DIELECTRIC MATERIAL IS ALSO DEFINED THAT COMPRISES A REINFORCING MATERIAL COMBINED WITH THE COMPOSITION, THE DIELECTRIC MATERIAL FORMING AT LEAST ONE LAYER IN COMBINATION WITH AT LEAST ONE CONDUCTIVE LAYER FOR THE ELECTRONIC PACKAGE.