公开(公告)号：JPH11335573A

公开(公告)日：1999-12-07

申请号：JP2986299

申请日：1999-02-08

Applicant: IBM

Inventor： JOHANSSON GARY A ,  PAPATHOMAS KONSTANTINOS I

IPC: H05K1/03 ,  B32B15/08 ,  C08K3/00 ,  C08K5/00 ,  C08L63/00 ,  C08L79/00 ,  C08L101/00 ,  H05K1/02 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To obtain a composition useful for a dielectric layer of a circuit plate by containing a resin material, a coloring agent and a fluorescent agent. SOLUTION: A resin derivative composition is comprised of containing: preferably about 78-about 98 wt.% of a resin material selected preferably from epoxy, cyanate and bismaleimide resins; preferably about 0.01-about 10 wt.% of a coloring agent selected from an organic dye, an organic pigment and an inorganic pigment; and preferably about 0.01-about 12 wt.% of a fluorescent agent as an ultraviolet absorption compound preferably containing the ultraviolet absorption compound to strengthen a fluorescent characteristic. An epoxy contains preferably an epoxy polymer resin including an epoxide derived from a monocyclic and polycyclic divalent phenol; and a cyanate contains preferably a polyfunctional cyanate ester monomer of the formula: R-(OCN)m (wherein m is 2-5; R is an aromatic organic group and NCO is bonded to an aromatic ring) or its polymer. A defect of a circuit can be inspected optically and accurately by applying a dielectric layer containing this composition to the circuit plate.

公开(公告)号：JP2002229857A

公开(公告)日：2002-08-16

申请号：JP2001369492

申请日：2001-12-04

Applicant: IBM

Inventor： FARQUHAR DONALD S ,  FEGER CLAUDIUS ,  MARKOVICH VOYA ,  PAPATHOMAS KONSTANTINOS I ,  MARK D PORIKUSU ,  SHAW JANE M ,  SZEPAROWYCZ GEORGE ,  WEINGART STEVE H

IPC: G06F12/14 ,  G06F1/00 ,  G06F21/00 ,  G06F21/06 ,  G06F21/22 ,  H01L23/58 ,  H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/16

Abstract: PROBLEM TO BE SOLVED: To provide a structure and a method of forming a fraudulent intrusion sensing electronic circuit enclosure including an integrated circuit structure, a mesh structure surrounding the integrated circuit, and a sealing enclosure surrounding the mesh structure. SOLUTION: The mesh structure includes a flexible dielectric layer having a first side and a second side, a screen print pattern of a first flexible conductive circuit line forming a first resistor network on the first side, and a photolithography forming pattern of a second flexible conductive circuit line forming a second resistor network on the second side.

公开(公告)号：DE69304871D1

公开(公告)日：1996-10-24

申请号：DE69304871

申请日：1993-11-15

Applicant: IBM

Inventor： PAPATHOMAS KONSTANTINOS I

IPC: C08G73/06 ,  C08J5/04 ,  H05K1/03 ,  H01B3/30 ,  C08G73/00

Abstract: Amorphous prepolymers from composition containing bisphenol P dicyanate and bisphenol M dicyanate as well as the cured polymers therefrom are prepared. The prepolymers are especially useful for circuit boards and structural composites.

公开(公告)号：HK1025183A1

公开(公告)日：2000-11-03

申请号：HK00104382

申请日：2000-07-18

Applicant: IBM

Inventor： APPELT BERND KARL ,  JOHANSSON GARY ALAN ,  PAPATHOMAS KONSTANTINOS I

IPC: H01L21/60 ,  H01L21/52 ,  H01L21/58 ,  H01L21/607 ,  H01L ,  C09J

Abstract: An organic chip carrier having metallic circuitry and wire bond pads thereon is bonded to an integrated circuit die by a photocurable adhesive and is electrically connected therewith by wire bonding to the wire bond pads.

公开(公告)号：GB2355342B

公开(公告)日：2003-06-18

申请号：GB0015036

申请日：2000-06-21

Applicant: IBM

Inventor： FARQUAR DONALD S ,  PAPATHOMAS KONSTANTINOS I ,  POLIKS MARK D

IPC: B32B15/082 ,  C08K3/00 ,  C08L27/12 ,  C08L101/00 ,  H01L23/14 ,  H05K1/02 ,  H05K1/03 ,  H05K3/38

Abstract: A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material.

公开(公告)号：DE69309028D1

公开(公告)日：1997-04-24

申请号：DE69309028

申请日：1993-12-09

Applicant: IBM

Inventor： PAPATHOMAS KONSTANTINOS I

IPC: C08G73/06 ,  C08J5/24 ,  C08L79/04 ,  C08L79/06 ,  H05K1/03 ,  C07C261/02

Abstract: The trifunctional cyanate ester, trisphenol PA tricyanate, is new. Also claimed are: (i) a prepolymer of trisphenol PA tricyanate wherein 5-50 % of the -OCN functional gps. are trimerised; (2) a compsn. contg. the prepolymer and an organic solvent; and (3) a crosslinked polymer, partic. the homopolymer, made by curing the prepolymer. The prepolymer has 5-30, pref. 5-20 % of the -OCN functional gps. of the cyanate ester trimerised. The solvent used in the prepolymer compsn. is pref. a ketone, esp. MEK, and the compsn. is pref. substantially free of other solvents.

公开(公告)号：MY133136A

公开(公告)日：2007-10-31

申请号：MYPI9902398

申请日：1999-06-11

Applicant: IBM

Inventor： APPELT BERND KARL ,  JOHANSSON GARY ALAN ,  PAPATHOMAS KONSTANTINOS I

IPC: H01L21/60 ,  H01L23/48 ,  B32B33/00 ,  H01L21/52 ,  H01L21/58 ,  H01L21/607 ,  H01L23/52 ,  H01L29/40

Abstract: AN ORGANIC CHIP CARRIER HAVING CIRCUITRY AND WIRE BOND PADS THEREON IS BONDED TO AN INTEGRATED CIRCUIT DIE BY A PHOTOCURABLE ADHESIVE AND IS ELECTRICALLY CONNECTED THEREWITH BY WIRE BONDING TO THE WIRE BOND PADS.

公开(公告)号：MY127684A

公开(公告)日：2006-12-29

申请号：MYPI20002291

申请日：2000-05-24

Applicant: IBM

Inventor： FARQUHAR DONALD S ,  PAPATHOMAS KONSTANTINOS I ,  POLIKS MARK D

IPC: B32B3/00 ,  B32B15/082 ,  C08K3/00 ,  C08L27/12 ,  C08L101/00 ,  H01L23/14 ,  H05K1/02 ,  H05K1/03 ,  H05K3/38

Abstract: A SEMICONDUCTOR DEVICE HAVING A THERMOSET-CONTAINING, DIELECTRIC MATERIAL AND METHODS FOR FABRICATING THE SAME IS PROVIDED. THE DEVICE MAY TAKE THE FORM OF A PRINTED CIRCUIT BOARD, AN INTEGRATED CIRCUIT CHIP CARRIER, OR THE LIKE. THE DIELECTRIC MATERIAL IS A NON-FIBRILLATED, FLUOROPOLYMER MATRIX (10) THAT HAS INORGANIC PARTICLES (14) DISTRIBUTED THEREIN AND IS IMPREGNATED WITH A THERMOSET MATERIAL (12).(FIG. 1)

公开(公告)号：MY119582A

公开(公告)日：2005-06-30

申请号：MYPI9900182

申请日：1999-01-15

Applicant: IBM

Inventor： JOHANSSON GARY A ,  PAPATHOMAS KONSTANTINOS I

IPC: B32B3/00 ,  B32B15/08 ,  H05K1/03 ,  C08F283/00 ,  C08K3/00 ,  C08K5/00 ,  C08L63/00 ,  C08L79/00 ,  C08L101/00 ,  H05K1/00 ,  H05K1/02 ,  H05K3/46

Abstract: A COMPOSITION FOR USE IN MAKING HIGH OPTICAL CONTRAST AND UV LIGHT FLUORESCING DIELECTRIC MATERIAL USUABLE IN PRINTED CIRCUIT BOARDS, WHICH IN TURN MAY FORM PART OF AN ELECTRONIC PACKAGE. THE COMPOSITION COMPRISES A RESIN, A COLORING AGENT, AND A FLUORESCING AGENT. A DIELECTRIC MATERIAL IS ALSO DEFINED THAT COMPRISES A REINFORCING MATERIAL COMBINED WITH THE COMPOSITION, THE DIELECTRIC MATERIAL FORMING AT LEAST ONE LAYER IN COMBINATION WITH AT LEAST ONE CONDUCTIVE LAYER FOR THE ELECTRONIC PACKAGE.

公开(公告)号：GB2355342A

公开(公告)日：2001-04-18

申请号：GB0015036

申请日：2000-06-21

Applicant: IBM

Inventor： FARQUAR DONALD S ,  PAPATHOMAS KONSTANTINOS I ,  POLIKS MARK D

IPC: B32B15/082 ,  C08K3/00 ,  C08L27/12 ,  C08L101/00 ,  H01L23/14 ,  H05K1/02 ,  H05K1/03 ,  H05K3/38

Abstract: A semiconductor device and method (32) for fabricating the same comprises a conductive layer, a dielectric layer comprising a fluoropolymer matrix having inorganic particles distributed therein (34) and a thermosetting resin (36) for bonding the conductive layer to the fluoropolymer matrix (38). The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like.