公开(公告)号：DE3781234D1

公开(公告)日：1992-09-24

申请号：DE3781234

申请日：1987-10-15

Applicant: IBM

Inventor： KIM JUNGIHL ,  LANGE WALTER FREDERICK ,  SHIH DA-YUAN ,  WEN SHEREE HSIAOU-RU

IPC: H01L23/52 ,  H01L21/3205 ,  H01L23/498 ,  H05K1/03 ,  H05K3/24 ,  H05K3/38 ,  H01L23/48

Abstract: A layer of zirconium (44) can be used as an adhesion layer between a ceramic or polyimide substrate (40) and subsequently applied metallic layers (46,48,50). Following the zirconium layer, copper can be deposited (46) followed by a reaction barrier layer (48) and a wettable surface layer (50) such as gold. This type of structure can be used for pin brazing, chip joining, and/or wire connections.