公开(公告)号：DE1764336A1

公开(公告)日：1972-03-23

申请号：DE1764336

申请日：1968-05-18

Applicant: IBM

Inventor： FEINBERG IRVING ,  LEE LANGDON JACK ,  LEE SITLER CARL

IPC: H01L21/8222 ,  H01L23/04 ,  H01L27/06 ,  H01L27/118 ,  H01L19/00

Abstract: 1,236,404. Integrated circuits. INTERNATIONAL BUSINESS MACHINES CORP. 9 May, 1968 [23 May, 1967], No. 46663/70. Divided out of 1,236,401. Heading H1K. The disclosure is identical with that of Specification 1,236,401 from which the present application is divided but the claims relate to a semi-conductor wafer comprising a plurality of areas each including a number of devices interconnected to form a circuit, the areas being in a co-ordinate array to permit dicing by intersecting sets of cuts and each being provided with a graded mark on two of its edges to permit a visual indication of the accuracy of dicing.