公开(公告)号：US3474530A

公开(公告)日：1969-10-28

申请号：US3474530D

申请日：1967-02-03

Applicant: IBM

Inventor： AINSLIE NORMAN G ,  CHHABRA DEVENDRA S ,  JEPSEN DONALD W ,  MUTTER WALTER E

IPC: H01B13/00 ,  H01L21/00 ,  H01L21/78 ,  H01L27/00 ,  H05K3/00

CPC classification number: H01L21/78 ,  H01B13/00 ,  H01L21/00 ,  H01L27/00 ,  Y10S438/927 ,  Y10T29/49004

公开(公告)号：US2889535A

公开(公告)日：1959-06-02

申请号：US54159255

申请日：1955-10-20

Applicant: IBM

Inventor： NATHANIEL ROCHESTER ,  JOHNSON JACOB R ,  AMDAHL GENE M ,  MUTTER WALTER E

IPC: G06K9/46

CPC classification number: G06K9/4604 ,  G06K2209/01

公开(公告)号：US3465427A

公开(公告)日：1969-09-09

申请号：US64421267

申请日：1967-06-07

Applicant: IBM

Inventor： BARSON FRED ,  MUTTER WALTER E

IPC: G01R31/28 ,  H01L21/8222 ,  H01L23/544 ,  B01J17/00 ,  H01L7/00

CPC classification number: H01L22/34 ,  G01R31/2884 ,  H01L21/8222 ,  H01L2924/3011

公开(公告)号：US3451866A

公开(公告)日：1969-06-24

申请号：US3451866D

申请日：1967-05-05

Applicant: IBM

Inventor： MUTTER WALTER E

IPC: H01L21/00 ,  H01L23/29 ,  H01L29/00 ,  H01L7/36 ,  H01L3/12 ,  H01L11/00

CPC classification number: H01L23/291 ,  H01L21/00 ,  H01L24/05 ,  H01L29/00 ,  H01L2224/04042 ,  H01L2224/48463 ,  H01L2924/12036 ,  H01L2924/12043 ,  Y10S148/037 ,  Y10S148/043 ,  Y10S148/098 ,  Y10S148/151 ,  Y10S438/919 ,  Y10S438/965 ,  H01L2924/00

公开(公告)号：US3548491A

公开(公告)日：1970-12-22

申请号：US3548491D

申请日：1968-11-14

Applicant: IBM

Inventor： AINSLIE NORMAN G ,  CHHABRA DEVENDRA S ,  JEPSEN DONALD W ,  MUTTER WALTER E

IPC: H01B13/00 ,  H01L21/00 ,  H01L21/78 ,  H01L27/00 ,  B01J17/00

CPC classification number: H01L21/78 ,  H01B13/00 ,  H01L21/00 ,  H01L27/00 ,  Y10T29/49758

公开(公告)号：US3461357A

公开(公告)日：1969-08-12

申请号：US3461357D

申请日：1967-09-15

Applicant: IBM

Inventor： MUTTER WALTER E ,  TOTTA PAUL A

IPC: H01L21/00 ,  H01L23/485 ,  H01L23/522 ,  H01L3/12 ,  H01L5/06

CPC classification number: H01L24/10 ,  H01L21/00 ,  H01L23/485 ,  H01L23/522 ,  H01L24/13 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：US3399331A

公开(公告)日：1968-08-27

申请号：US42103564

申请日：1964-12-24

Applicant: IBM

Inventor： MUTTER WALTER E ,  PURCELL EDWARD D

IPC: C22C32/00 ,  C23C14/14 ,  H01B1/00 ,  H01L21/00 ,  H01L23/485

CPC classification number: H01L21/00 ,  C22C32/00 ,  C22C32/0052 ,  C23C14/14 ,  H01B1/00 ,  H01L23/485 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：US3067071A

公开(公告)日：1962-12-04

申请号：US15460

申请日：1960-01-04

Applicant: IBM

Inventor： MUTTER WALTER E

IPC: H01L21/00 ,  H01L23/29

CPC classification number: H01L21/00 ,  H01L23/291 ,  H01L2924/0002 ,  Y10T428/12528 ,  H01L2924/00

公开(公告)号：US3558352A

公开(公告)日：1971-01-26

申请号：US3558352D

申请日：1966-10-27

Applicant: IBM

Inventor： CASTRUCCI PAUL P ,  WITT DAVID DE ,  MUTTER WALTER E ,  DHAKA VIR A

IPC: H01L21/00 ,  H01L21/331 ,  H01L23/485 ,  H01L29/00 ,  H01L1/14 ,  H01L5/02

CPC classification number: H01L23/485 ,  H01L21/00 ,  H01L29/00 ,  H01L29/66303 ,  H01L2924/0002 ,  Y10S438/951 ,  H01L2924/00

Abstract: A SEMICONDUCTIVE DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE WHEREIN THE OHMIC CONTACT IS IN THE ORDER OF MICRONS IN WIDTH. A FIRST METAL IS FORMED IN THE OPENING IN THE PROTECTIVE COATING WHICH ACTS AS THE OHMIC CONTACT TO THE SEMICONDUCTOR DEVICE. A SECOND METAL MAY BE APPLIED ONLY OVER THE FIRST METAL BY ELECTROLESS OR ELECTROPLATING TECHNIQUES TO INCREASE THE CONDUCTIVITY OF THE OHMIC CONTACT. FINALLY, AN EXTERNAL LAND METAL LAYER IS DEPOSITED OVER A RELATIVELY LARGE AREA OF THE PROTECTIVE COATING IN THE AREA OF THE OHMIC CONTACT WITH FINGER-LIKE EXTENSIONS OF THE LAND METAL LAYER CONTACTING THE OHMIC CONTACT BY SHORT OVERLAID AREAS. THE EXTERNAL LAND IS THE ONLY METAL LAYER IN THE PROCESS FORMED WHICH REQUIRES A PHOTOGRAPHIC MASK. THE PROCESS, THEREFORE, IN NOT LIMITED BY PRESENT DAY PHOTOENGRAVING TECHNIQUES.

公开(公告)号：US3335340A

公开(公告)日：1967-08-08

申请号：US34683464

申请日：1964-02-24

Applicant: IBM

Inventor： FRED BARSON ,  MUTTER WALTER E

IPC: G01R31/28 ,  H01L21/8222 ,  H01L23/544

CPC classification number: H01L22/34 ,  G01R31/2884 ,  H01L21/8222 ,  H01L2924/3011