公开(公告)号：EP1987404A4

公开(公告)日：2011-03-02

申请号：EP07717186

申请日：2007-02-01

Applicant: IBM

Inventor： DANG HIEN P ,  SRI-JAYANTHA SRI M

IPC: G11B9/00 ,  G05B11/42

CPC classification number: G02B26/085 ,  B82Y10/00 ,  G02B26/101 ,  G11B9/1454 ,  G11B9/1481

公开(公告)号：WO2006008215A3

公开(公告)日：2006-06-08

申请号：PCT/EP2005052768

申请日：2005-06-15

Applicant: IBM ,  IBM FRANCE ,  SRI-JAYANTHA SRI M ,  DANG HIEN P ,  SHARMA ARUN

Inventor： SRI-JAYANTHA SRI M ,  DANG HIEN P ,  SHARMA ARUN

IPC: G06F1/20

CPC classification number: G06F1/206

Abstract: A method (and system) of predicting a thermal state of a transient thermal system, includes combining sensor outputs and thermal parameters to construct a consistent set of estimates of internal temperature of a transient thermal system.

Abstract translation: 预测瞬态热系统的热状态的方法（和系统）包括组合传感器输出和热参数以构建瞬态热系统的内部温度的一致估计集合。

公开(公告)号：JP2003346392A

公开(公告)日：2003-12-05

申请号：JP2003139845

申请日：2003-05-19

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーション

Inventor： ALBRECHT THOMAS ,  BINNIG GERD ,  ELEFTHERIOU EVANGELOS ,  POZIDIS CHARALAMPOS ,  SRI-JAYANTHA SRI M ,  VETTIGER PETER

IPC: G11B9/14 ,  G11B9/00 ,  G11B27/10

CPC classification number: G11B27/102 ,  B82Y10/00 ,  G11B9/14 ,  G11B9/1418 ,  G11B9/1454 ,  G11B9/1472 ,  G11B2005/0021

Abstract: PROBLEM TO BE SOLVED: To provide a storage medium and a method for scanning a storage medium. SOLUTION: The storage medium (1) for storing data in the form of marks (5) is scanned by an array of probes (2) for mark detecting purposes in a scanning mode. The storage medium (1) has fields (4) with each field (41, 42) to be scanned by an associated one of the probes (21). At least one of the fields (42) has marks representing operational data for operating the scanning mode. Scanning parameter are computed from the operational data and the scanning mode is adjusted according to the computed parameters. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供一种用于扫描存储介质的存储介质和方法。 解决方案：用于以标记（5）的形式存储数据的存储介质（1）由用于扫描模式的标记检测目的的探针（2）阵列扫描。 存储介质（1）具有场（4），每个场（41,42）被相关联的一个探针（21）扫描。 至少一个字段（42）具有表示用于操作扫描模式的操作数据的标记。 根据运算数据计算扫描参数，根据计算参数调整扫描模式。 版权所有（C）2004，JPO

公开(公告)号：WO2007092327A3

公开(公告)日：2008-04-24

申请号：PCT/US2007002928

申请日：2007-02-01

Applicant: IBM ,  DANG HIEN P ,  SRI-JAYANTHA SRI M

Inventor： DANG HIEN P ,  SRI-JAYANTHA SRI M

IPC: G05B19/33

CPC classification number: G02B26/085 ,  B82Y10/00 ,  G02B26/101 ,  G11B9/1454 ,  G11B9/1481

Abstract: A method of optimizing a servo controller power required in the operation of twodimensional flexure (Microelectronic Memory Storage) MEMS devices. Furthermore, provided is an arrangement for optimizing servo controller power in a two-dimensional flexure MEMS storage device through a utilization of the inventive method.

Abstract translation: 一种优化二维弯曲（微电子存储器）MEMS器件操作所需的伺服控制器功率的方法。 此外，提供了一种通过利用本发明的方法来优化二维挠曲MEMS存储装置中的伺服控制器功率的装置。

公开(公告)号：JP2007110115A

公开(公告)日：2007-04-26

申请号：JP2006274688

申请日：2006-10-06

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： SINHA ARVIND KUMAR ,  SRI-JAYANTHA SRI M ,  VIJAYESHWAR DAS KHANNA ,  KUCZYNSKI JOSEPH

IPC: H01L23/36

CPC classification number: H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a method and an apparatus for optimizing heat transfer with electronic components. SOLUTION: A heat transfer assembly comprises a printed circuit board assembly that supports an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. A loading assembly is included for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism that contains a sufficient amount of a thermally conductive medium is provided to transfer heat between the surfaces of one or more of the semiconductor chips and the heat sink assembly. The thermally conductive medium fills every gap or space between the one or more semiconductor chips and the heat sink assembly. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于优化与电子部件的传热的方法和装置。 解决方案：传热组件包括支撑包括一个或多个半导体芯片的电子部件组件的印刷电路板组件。 散热器组件适于与一个或多个半导体芯片热接合。 包括装载组件，用于将一个或多个半导体芯片装载到与散热器组件接合。 提供包含足够量的导热介质的封装机构，以在半导体芯片和散热器组件中的一个或多个的表面之间传递热量。 导热介质填充一个或多个半导体芯片和散热器组件之间的每个间隙或空间。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：BR0005794A

公开(公告)日：2001-12-11

申请号：BR0005794

申请日：2000-11-22

Applicant: IBM

Inventor： SRI-JAYANTHA SRI M ,  KHANNA VIJAYESHWAR DAS ,  MCVICKER GERARD M ,  DANG IEN ,  SHARMA ARUN ,  SATOH KIYOSHI ,  NAKAMOTO TATSUO

IPC: G11B33/12 ,  G11B25/04 ,  G11B33/08 ,  G11B5/54

Abstract: A system for mounting a hard disk enclosure (HDE), includes a casing pivotably mounted to minimize at least one of settle-out dynamics, external rotational vibration, and emitted vibration, the casing allowing the HDE to rotate substantially freely, wherein the center of gravity of the HDE is substantially the same as a pivot point of the casing. Further, a computer chassis includes a housing, at least one disk drive assembly for being housed by the housing, and a plurality of theta-mounts integrally built within the housing.

公开(公告)号：CA2386719A1

公开(公告)日：2001-07-05

申请号：CA2386719

申请日：2000-12-12

Applicant: IBM

Inventor： NAKAMOTO TATSUO ,  SHARMA ARUN ,  SATOH KIYOSHI ,  DANG HIEN ,  MCVICKER GERARD ,  KHANNA VIJAYESHWAR DAS ,  SRI-JAYANTHA SRI M

IPC: G11B33/12 ,  G11B25/04 ,  G11B33/08

Abstract: A system for mounting a head/disk assembly (HDA), of the type including at least one information storage disk, a spindle on which said disk is rotatabl y mounted and a rotary actuator for positioning at least one head relative to the disk comprises a support structure and means (87, 83) for mounting the H DA on the support structure to permit a limited amount of substantially free rotation in reaction to movement of the actuator thereby to reduce vibration in the HDA. The HDA may be part of a hard disk enclosure (HDE) or an entire hard disk drive (HDD) mounted in a computer chassis.