公开(公告)号：DE3678247D1

公开(公告)日：1991-04-25

申请号：DE3678247

申请日：1986-10-14

Applicant: IBM

Inventor： CLARKE THOMAS CARL ,  LU NENG HSING ,  TOMKIEWICZ YAFFA ,  TONG HO MING

IPC: C08J5/24 ,  H05K1/03 ,  H05K3/02

Abstract: A process for the manufacture of void-free prepreg sheets formed by the impregnation of a reinforcing cloth (e.g. glass fibre cloth) with a solution of a thermosetting resin (e.g. epoxy resin). In the process, the reinforcing cloth is first prewetted with a liqid medium containing a solvent for the resin which has a viscosity less than that of the solution of thermosetting resin. The prewetted cloth is impregnated with a solution of the resin and then heated to remove the solvent and cure the resin. The prepreg sheets are used in the manufacture of printed circuit boards.