公开(公告)号：DE3066749D1

公开(公告)日：1984-04-05

申请号：DE3066749

申请日：1980-07-18

Applicant: IBM

Inventor： ENGLER EDWARD MARTIN ,  KUPTSIS JOHN DEMOSTHENES ,  SCHAD ROBERT GERARD ,  TOMKIEWICZ YAFFA

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039 ,  G03C1/72 ,  G03C1/68

公开(公告)号：DE3683028D1

公开(公告)日：1992-01-30

申请号：DE3683028

申请日：1986-10-21

Applicant: IBM

Inventor： DONELON JOHN JOSEPH ,  TOMKIEWICZ YAFFA ,  WASSICK THOMAS ANTHONY ,  YEH JAMES TIEN-CHENG

IPC: C23F1/00 ,  C23F4/00 ,  G03F7/004 ,  G03F7/20 ,  H01L21/268 ,  H01L21/302 ,  H01L21/311 ,  H01L21/3213 ,  H05K3/02 ,  H01L21/48 ,  H01L21/90

公开(公告)号：DE3682745D1

公开(公告)日：1992-01-16

申请号：DE3682745

申请日：1986-09-19

Applicant: IBM

Inventor： GROBMAN WARREN DAVID ,  HO FAHFU ,  HURST JR ,  TOMKIEWICZ YAFFA

IPC: H05K3/08 ,  C23F4/00 ,  C23F4/02 ,  B23K26/18 ,  H01L21/31

Abstract: A process for radiation induced dry etching a metallised (e.g. copper) substrate is disclosed wherein the substrate is exposed to a patterned beam of laser radiation in a halogen gas atmosphere which is reactive with the substrate to form a metal halide salt reaction product to accelerate the formation of the metal halide salt without its substantial removal from the substrate. The metal halide salt is removed from the substrate by contact of the substrate with a solvent for the metal halide salt.

公开(公告)号：DE3678247D1

公开(公告)日：1991-04-25

申请号：DE3678247

申请日：1986-10-14

Applicant: IBM

Inventor： CLARKE THOMAS CARL ,  LU NENG HSING ,  TOMKIEWICZ YAFFA ,  TONG HO MING

IPC: C08J5/24 ,  H05K1/03 ,  H05K3/02

Abstract: A process for the manufacture of void-free prepreg sheets formed by the impregnation of a reinforcing cloth (e.g. glass fibre cloth) with a solution of a thermosetting resin (e.g. epoxy resin). In the process, the reinforcing cloth is first prewetted with a liqid medium containing a solvent for the resin which has a viscosity less than that of the solution of thermosetting resin. The prewetted cloth is impregnated with a solution of the resin and then heated to remove the solvent and cure the resin. The prepreg sheets are used in the manufacture of printed circuit boards.

公开(公告)号：IT1149813B

公开(公告)日：1986-12-10

申请号：IT2352880

申请日：1980-07-18

Applicant: IBM

Inventor： ENGLER EDWARD MARTIN ,  KUPTSIS DEMOSTHENES JOHN ,  SCHAD GERARD ROBERT ,  TOMKIEWICZ YAFFA

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039 ,  H01L

公开(公告)号：CA1165761A

公开(公告)日：1984-04-17

申请号：CA354062

申请日：1980-06-16

Applicant: IBM

Inventor： ENGLER EDWARD M ,  KUPTSIS JOHN D ,  SCHAD ROBERT G ,  TOMKIEWICZ YAFFA

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039 ,  G03C1/72 ,  G03C5/04

Abstract: Novel E-beam resists and process for their use are described. These resists are conducting organic charge transfer salts. Films of these materials can be deposited by solvent casting or by sublimation. The deposited film can be made to produce a positive or negative resist image depending on the E-beam energy and exposure time. Exposure of this material to an E-beam produces patterns having differential electrical, optical and solvation properties.