公开(公告)号：JPH10303331A

公开(公告)日：1998-11-13

申请号：JP9926098

申请日：1998-04-10

Applicant: IBM

Inventor： VENDRAMIN GIUSEPPE

IPC: H05K9/00 ,  H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H01L23/60 ,  H05K1/18

Abstract: PROBLEM TO BE SOLVED: To manufacture an HF device using a base organic material which is commonly available at low cost, by manufacturing a Faraday cage which protects an active device from a disturbance of a radio wave device interference caused by a natural electromagnetic radiation of a radio wave frequency in an atmosphere, or as a result of it. SOLUTION: In order to shield from an HF electromagnetic wave, an active element 401 must be perfectly enclosed with a Faraday cage. Here, a lateral-side surface of the cage is constituted with a plated through hole 301 and a solder ball 303 connected each other. The through hole 301 realizes a shield in a substrate, while the solder ball 303 assures a lateral shield between the substrate and a main substrate. A grounded surface 403 in the main substrate connected appropriately to the solder ball 303 constitutes a lower surface of the Faraday cage, while an upper surface is realized by connecting an upper metal plate 405. The upper metal plate constitutes the upper surface of a cavity down module together with the through hole 301.

公开(公告)号：DE69735157T2

公开(公告)日：2006-08-31

申请号：DE69735157

申请日：1997-11-06

Applicant: IBM

Inventor： VENDRAMIN GIUSEPPE

IPC: H01L23/60 ,  H01L23/12 ,  H05K9/00 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H05K1/18

Abstract: A Plastic Ball Grid Array electronic package of the Cavity Down type for use in HF application. A Faraday Cage is realized to protect the active element from external HF wave interferences. The lateral sides of the Faraday Cage are constituted by a row of solder balls connected in a zig-zag way to plated through holes along the four edges of the substrate. The top side of the Cage is the metal stiffener of the Cavity Down package electrically connected to the through holes, while the bottom side is represented by the ground plane of the main board properly connected to the solder balls.

公开(公告)号：MY115578A

公开(公告)日：2003-07-31

申请号：MYPI9801504

申请日：1998-04-03

Applicant: IBM

Inventor： VENDRAMIN GIUSEPPE

IPC: H01L23/48 ,  H01L23/12 ,  H05K9/00 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H01L23/60 ,  H05K1/18

Abstract: A PLASTIC BALL GRID ARRAY ELECTRONIC PACKAGE OF THE CAVITY DOWN TYPE FOR USE IN HF APPLICATION. A FARADAY CAGE IS REALIZED TO PROTECT THE ACTIVE ELEMENT (401)FROM EXTERNAL HF WAVE INTERFERENCES. THE LATERAL SIDES OF THE FARADAY CAGE ARE CONSTITUTED BY A ROW OF SOLDER BALLS(303,305) CONNECTED IN A ZIG-ZAG WAY TO PLATED THROUGH HOLES ALONG THE FOUR EDGES OF THE SUBSTRATE. THE TOP SIDE OF THE CAGE IS THE METAL STIFFENER(405) OF THE CAVITY DOWN PACKAGE ELECTRICALLY CONNECTED TO THE THROUGH HOLES, WHILE THE BOTTOM SIDE IS REPRESENTED BY THE GROUND PLANE(403) OF THE MAIN BOARD PROPERLY CONNECTED TO THE SOLDER BALLS. (FIG. 3)

公开(公告)号：GB2324649A

公开(公告)日：1998-10-28

申请号：GB9707679

申请日：1997-04-16

Applicant: IBM

Inventor： VENDRAMIN GIUSEPPE

IPC: H01L23/12 ,  H01L23/498 ,  H05K9/00 ,  H01L23/50 ,  H01L23/552 ,  H01L23/60 ,  H05K1/18 ,  H01L23/488

Abstract: A Plastic Ball Grid Array package of the Cavity Down type comprises a Faraday Cage to protect the semiconductor chip from external HF wave interferences. The lateral sides of the Faraday Cage are constituted by a row of solder balls 303 connected in a zig-zag way to plated through holes 301 along the four edges of a plastics substrate on which the chip is mounted. The top side of the Cage is the metal plate of the Cavity Down package electrically connected to the through holes, while the bottom side is formed by the ground plane of the main board connected to the solder balls.

公开(公告)号：DE69735157D1

公开(公告)日：2006-04-13

申请号：DE69735157

申请日：1997-11-06

Applicant: IBM

Inventor： VENDRAMIN GIUSEPPE

IPC: H01L23/60 ,  H01L23/12 ,  H05K9/00 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H05K1/18

Abstract: A Plastic Ball Grid Array electronic package of the Cavity Down type for use in HF application. A Faraday Cage is realized to protect the active element from external HF wave interferences. The lateral sides of the Faraday Cage are constituted by a row of solder balls connected in a zig-zag way to plated through holes along the four edges of the substrate. The top side of the Cage is the metal stiffener of the Cavity Down package electrically connected to the through holes, while the bottom side is represented by the ground plane of the main board properly connected to the solder balls.

公开(公告)号：GB2358957B

公开(公告)日：2004-06-23

申请号：GB9925318

申请日：1999-10-27

Applicant: IBM

Inventor： OGGIONI STEFANO ,  VENDRAMIN GIUSEPPE

IPC: H01L23/498 ,  H01L23/552 ,  H01L23/488 ,  H05K1/05

Abstract: A Plastic Ball Grid Array electronic package of the Cavity Down type for use in HF application. The present invention allows to reduce the overall thickness of the package, by tailoring the different mechanical portions of the module structure (interconnection balls, grounded stiffener thickness). A thin dielectric layer is laid on a metal (e.g. copper) stiffener. A chip is attached on the same side of the dielectric layer and the electrical connections between the chip and the pads are done with metallic traces running on the surface of the dielectric layer. The external rows of balls are not connected to the circuit traces; they are electrically connected to the metal stiffener to realize the lateral shielding for the HF applications. The connection between the balls and the metal stiffener (which acts as the ground plane) is done by means of photovias. One of the more important aspects of the present invention is the dramatic reduction of the parasitic impedance.

公开(公告)号：ES2256872T3

公开(公告)日：2006-07-16

申请号：ES97308907

申请日：1997-11-06

Applicant: IBM

Inventor： VENDRAMIN GIUSEPPE

IPC: H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H05K9/00 ,  H01L23/60 ,  H05K1/18 ,  H01L23/66

Abstract: ENCAPSULADO ELECTRONICO DE MATRIZ DE MALLA DE BOLAS PLASTICO DE TIPO CAVIDAD HACIA ABAJO PARA SU USO EN APLICACIONES DE HF. SE REALIZA UNA JAULA DE FARADAY PARA PROTEGER EL ELEMENTO ACTIVO DE INTERFERENCIAS DE ONDAS DE HF EXTERNAS. LOS LATERALES DE LA JAULA DE FARADAY ESTAN CONSTITUIDOS POR UNA FILA DE BOLAS DE SOLDADURA CONECTADAS EN ZIG-ZAG A TALADROS PASANTES METALIZADOS A LO LARGO DE LOS CUATRO BORDES DEL SUSTRATO. EL LADO SUPERIOR DE LA JAULA ES EL REFUERZO METALICO DEL ENCAPSULADO DE CAVIDAD HACIA ABAJO CONECTADO ELECTRICAMENTE A LOS TALADROS PASANTES, MIENTRAS QUE EL LADO INFERIOR ESTA REPRESENTADO POR EL PLANO DE MASA DE LA PLACA PRINCIPAL CONECTADO A LAS BOLAS DE SOLDADURA.

公开(公告)号：AT316692T

公开(公告)日：2006-02-15

申请号：AT97308907

申请日：1997-11-06

Applicant: IBM

Inventor： VENDRAMIN GIUSEPPE

IPC: H05K9/00 ,  H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H01L23/60 ,  H05K1/18 ,  H01L23/66

Abstract: A Plastic Ball Grid Array electronic package of the Cavity Down type for use in HF application. A Faraday Cage is realized to protect the active element from external HF wave interferences. The lateral sides of the Faraday Cage are constituted by a row of solder balls connected in a zig-zag way to plated through holes along the four edges of the substrate. The top side of the Cage is the metal stiffener of the Cavity Down package electrically connected to the through holes, while the bottom side is represented by the ground plane of the main board properly connected to the solder balls.

公开(公告)号：GB2358957A

公开(公告)日：2001-08-08

申请号：GB9925318

申请日：1999-10-27

Applicant: IBM

Inventor： OGGIONI STEFANO ,  VENDRAMIN GIUSEPPE

IPC: H01L23/498 ,  H01L23/552 ,  H01L23/488 ,  H05K1/05

Abstract: A Ball Grid Array electronic package of the Cavity Down type for use in HF application comprises a thin dielectric layer 403 laid on a stiffener 401 made from a metal such as copper. Circuit traces are laid on the dielectric layer 403 and have one end connected to an active element 407 mounted on the same side of the dielectric layer 403 and the other end connected to solder balls 411 for connecting the active element 407 to the mother board. Peripherally to the traces, metallised photovias are connected to the metal stiffener 401 , which acts as a ground plane, and solder balls 413 for connection with the mother board to realise the lateral shielding for HF applications. The package leads to a dramatic reduction in pirasitic impedence and allows a reduction in the overall thickness of the package.