公开(公告)号：US3628717A

公开(公告)日：1971-12-21

申请号：US3628717D

申请日：1969-11-12

Applicant: IBM

Inventor： LYNCH JOHN R ,  OTTEN LEONARD E ,  WENSKUS HERBERT

IPC: H01L21/68 ,  B23K3/00 ,  H01L21/00 ,  B23K1/00 ,  B23K5/00

CPC classification number: H01L21/67144 ,  H01L2924/01322

Abstract: This patent discloses a method and apparatus for aligning and joining a semiconductor chip to a substrate or carrier. The apparatus for first aligning and then bonding the chip to a substrate comprises a first system which includes first alignment means, immediately below the alignment means there being a substrate receiving means which is movable so as to permit alignment of the substrate in a predetermined position relative to the first alignment means. A second system cooperates with the first system and includes a vacuum-operated chip receiver. The first system is then moved until the chip is superimposed of the substrate and means are provided to press the chip into contact with the substrate. A heater located in the substrate receiving means heats the substrate and while the chip is being held against the substrate the substrate receiving means is rotated arcuately, the substrate bearing against the chip and causing a scrubbing action to inhibit the presence of voids in the bond interface.

公开(公告)号：US3572736A

公开(公告)日：1971-03-30

申请号：US3572736D

申请日：1969-06-19

Applicant: IBM

Inventor： LYNCH JOHN R ,  OTTEN LEONARD E ,  WENSKUS HERBERT

IPC: B25B11/00 ,  H01L21/683 ,  B23B31/30

CPC classification number: H01L21/6838 ,  B25B11/005 ,  Y10T279/11 ,  Y10T279/17231 ,  Y10T279/18

Abstract: This patent discloses a vacuum operated chuck for clamping small workpieces such as integrated circuit chips. The chuck includes a housing having hingeably connected jaws, the jaws being biased apart or in the open position as by a biasing hinge. A chamber is located in the jaws and at the lower portion thereof is a workpiece receiver dimensioned for registration with a workpiece. At the upper portion of the housing is window means which is positioned to permit viewing of the receiver and thus the inwardly facing portion of any workpiece held thereby. The chamber is connected through a conduit to a vacuum supply which causes pivotal action of the jaws permitting the receiver to grasp the workpiece when it overlies the workpiece and is in registry therewith.

公开(公告)号：DE2860348D1

公开(公告)日：1981-02-12

申请号：DE2860348

申请日：1978-11-13

Applicant: IBM

Inventor： MEYEN ROBERT H ,  PUTTLITZ KARL J ,  SCHINK KARL ,  WENSKUS HERBERT

IPC: H05K3/34 ,  B23K1/005 ,  H01L21/60 ,  H05K13/00 ,  H01L21/68 ,  B23K1/00

Abstract: An individual chip soldering machine comprising an infrared heat source (42) enclosed by an energy concentrating reflector (44). The energy outlet from the reflector is covered by a quartz plate (46). A shield member (48) defines a second energy outlet (13). Vacuum suction can be admitted to the chamber (47) to hold a chip against the wall (50) of the outlet (13). The substrate (10) is mounted on a preheating chamber (126) comprising infrared heater (120) and surrogate substrate (11). The heater (120) is energised from power source (134) controlled by controller (132) responsive to the output of thermocouple (130) attached to substrate (11). In use the reflector is moved towards the substrate (10) until the outlet (13) contacts a chip on the substrate (10). The reflector is then backed off a predetermined distance which is such that the focal plane of the heat energy focused by the reflector (44), coincides with the solder containing space between the chip and the substrate.

公开(公告)号：DE3377685D1

公开(公告)日：1988-09-15

申请号：DE3377685

申请日：1983-05-06

Applicant: IBM

Inventor： SCHINK KARL ,  WENSKUS HERBERT

IPC: B23K1/018 ,  H01L21/60 ,  H05K3/34 ,  H05K13/04 ,  H01L21/68