公开(公告)号：US20220107914A1

公开(公告)日：2022-04-07

申请号：US17429873

申请日：2020-03-14

Applicant: Intel Corporation

Inventor： Altug Koker ,  Ben Ashbaugh ,  Scott Janus ,  Aravindh Anantaraman ,  Abhishek R. Appu ,  Niranjan Cooray ,  Varghese George ,  Arthur Hunter ,  Brent E. Insko ,  Elmoustapha Ould-Ahmed-Vall ,  Selvakumar Panneer ,  Vasanth Ranganathan ,  Joydeep Ray ,  Kamal Sinha ,  Lakshminarayanan Striramassarma ,  Surti Prasoonkumar ,  Saurabh Tangri

IPC: G06F15/78

Abstract: Embodiments are generally directed to a multi-tile architecture for graphics operations. An embodiment of an apparatus includes a multi-tile architecture for graphics operations including a multi-tile graphics processor, the multi-tile processor includes one or more dies; multiple processor tiles installed on the one or more dies; and a structure to interconnect the processor tiles on the one or more dies, wherein the structure to enable communications between processor tiles the processor tiles.