公开(公告)号：US20160157334A1

公开(公告)日：2016-06-02

申请号：US14893255

申请日：2013-12-12

Applicant: KANEKA CORPORATION

Inventor： Aki KOUKAMI ,  Kazuo HAGIWARA ,  Keisuke OGUMA ,  Kazuhide FUJIMOTO

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/0104 ,  H05K2201/06 ,  H05K2201/10371 ,  H05K2201/10545 ,  H05K2203/1327 ,  H01L2924/00

Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

Abstract translation: 一种散热结构，包括：印刷电路板; 第一发热元件; 第二发热元件; 和导热性可固化液体树脂组合物的固化物，所述印刷电路板具有与所述第一表面相对的第一表面和第二表面，所述第一发热元件设置在所述第一表面上， 所述第一发热元件被放置在所述第二表面上，所述第一发热元件产生与所述第二发热元件相同或更多的热量，所述第二发热元件被所述固化产物包围，所述第一发热元件 被具有比固化产物低的热导率的层包围。