公开(公告)号：US20160374206A1

公开(公告)日：2016-12-22

申请号：US14742070

申请日：2015-06-17

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Jaen-Don Lan ,  PIN-CHUNG LIN ,  CHEN-RUI TSENG ,  CHENG-EN HO ,  YU-AN CHEN

IPC: H05K3/00 ,  B23K26/402 ,  H05K3/16 ,  B23K26/386

CPC classification number: B23K26/402 ,  B23K26/382 ,  B23K26/389 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/30 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0341

Abstract: Disclosed is a method for manufacturing a circuit board, including preparing a substrate having a resin layer and a stop layer, forming at least one conduction hole penetrating the resin layer and stopping at the stop layer, forming a first metal layer through a sputtering process, forming a second metal layer on the first metal layer through a chemical plating process, forming a third metal layer having a circuit pattern, exposing part of the second metal layer and filling up the conduction hole through an electroplating process, and etching the second metal layer and the first metal layer under the second metal layer to expose the resin layer under the first metal layer. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and stable. The etched circuit pattern has a line width/pitch less than 10 μm for fine line width/pitch.

Abstract translation: 公开了一种制造电路板的方法，包括制备具有树脂层和停止层的基板，形成穿过树脂层的至少一个导电孔并在停止层处停止，通过溅射工艺形成第一金属层， 通过化学镀工艺在第一金属层上形成第二金属层，形成具有电路图案的第三金属层，暴露第二金属层的一部分并通过电镀工艺填充导电孔，并蚀刻第二金属层 以及第二金属层下面的第一金属层，以暴露第一金属层下的树脂层。 由于第一金属层提供优异的表面性质，所以第二和第三金属层是良好固定和稳定的。 蚀刻电路图案对于细线宽/间距具有小于10μm的线宽/间距。

公开(公告)号：US20160372409A1

公开(公告)日：2016-12-22

申请号：US14742098

申请日：2015-06-17

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Jaen-Don Lan ,  PIN-CHUNG LIN ,  CHEN-RUI TSENG ,  CHENG-EN HO ,  YU-AN CHEN

IPC: H01L23/498

CPC classification number: H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894

Abstract: Disclosed is a circuit board structure, including the first, second and third metal layers sequentially stacked on the substrate from bottom to top and formed by the sputtering process, the chemical plating process and the electroplating process, respectively. The substrate includes the stop layer and the resin layer stacked on the stop layer. The stop layer includes a pattern having at least one contact region, which is not covered by the resin layer. The first, second and third metal layers have an etched circuit pattern, respectively, and each of the etched circuit patterns is provided out of the corresponding contact region and aligned to each other to expose part of the resin layer. The etched circuit pattern is used for electrical connection. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and more stable.

Abstract translation: 公开了一种电路板结构，其包括分别从底部到顶部依次层叠在基板上的第一，第二和第三金属层，并通过溅射工艺，化学镀工艺和电镀工艺形成。 基板包括停止层和层叠在停止层上的树脂层。 止挡层包括具有至少一个不被树脂层覆盖的接触区域的图案。 第一，第二和第三金属层分别具有蚀刻电路图案，并且每个蚀刻电路图案被提供在相应的接触区域之外并且彼此对准以暴露部分树脂层。 蚀刻电路图案用于电连接。 由于第一金属层提供优异的表面性质，所以第二和第三金属层是良好固定的并且更稳定。