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    LOW POWER, HIGH SPEED MULTI-CHANNEL CHIP-TO-CHIP INTERFACE USING DIELECTRIC WAVEGUIDE
    1.
    发明申请
    LOW POWER, HIGH SPEED MULTI-CHANNEL CHIP-TO-CHIP INTERFACE USING DIELECTRIC WAVEGUIDE 审中-公开
    低功率，高速多通道芯片到芯片接口使用介质波导

    公开(公告)号：WO2014104536A1

    公开(公告)日：2014-07-03

    申请号：PCT/KR2013/008240

    申请日：2013-09-12

    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

    Inventor： BAE, Hyeon Min ,  JIN, Huxian ,  SONG, Ha Il

    IPC: H01P3/16

    CPC classification number: H01P3/16 ,  H01P3/122 ,  H01P5/107

    Abstract: An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device.

    Abstract translation: 本发明的示例性实施例提供了一种改进的电介质波导，称为电光纤。 具有金属覆层的电光纤可以隔离其它无线信道和相邻电缆中的信号的干扰，这通常导致带限问题，以减小辐射损耗，并且更好的信号导向以降低总的收发机功率消耗，因为传输 距离增加。 此外，电光纤可以具有频率独立的衰减特性，以便由于电光纤和互连设备的垂直耦合而很少或甚至没有任何额外的接收器侧补偿来实现高数据速率传输。

    CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE
    2.
    发明公开
    CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE 审中-公开
    用微带电路和介质波导芯片与芯片的接口

    公开(公告)号：EP3267528A1

    公开(公告)日：2018-01-10

    申请号：EP15884067.8

    申请日：2015-06-02

    Applicant: Korea Advanced Institute of Science and Technology

    Inventor： BAE, Hyeon Min ,  SONG, Ha Il ,  JIN, Huxian

    IPC: H01P3/08

    CPC classification number: H01P5/087 ,  H01P1/20309 ,  H01P3/082 ,  H01P3/16 ,  H01P5/1007

    Abstract: Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.

    Abstract translation: 公开了使用微带电路和电介质波导的芯片到芯片接口。 根据本发明的一个实施例的板间连接装置包括：具有金属包层并将信号从发送器侧板传送到接收器侧板的波导管; 以及连接到所述波导并且具有微带到波导转换（MWT）的微带电路，其中所述微带电路匹配微带线和所述波导，调节所述微带线到所述波导中的预定第一频带的带宽 信号，并将其提供给接收器。

    CONNECTOR FOR COUPLING WAVEGUIDE WITH BOARD
    8.
    发明公开
    CONNECTOR FOR COUPLING WAVEGUIDE WITH BOARD 审中-公开

    公开(公告)号：EP3764460A1

    公开(公告)日：2021-01-13

    申请号：EP19781520.2

    申请日：2019-04-05

    Applicant: Korea Advanced Institute Of Science And Technology

    Inventor： BAE, Hyeon Min ,  SONG, Ha Il

    IPC: H01P5/08 ,  H01P5/18

    Abstract: According to one aspect of the invention, there is provided a connector for connecting a waveguide and a board, comprising: a first opening part formed in a direction perpendicular to one side of a board and coupled to the one side of the board; a second opening part formed in a direction parallel to a longitudinal direction of a waveguide for signal transmission, wherein the waveguide is capable of being coupled to the second opening part; and a signal guide part connecting the first and second opening parts and including a hollowness surrounded by a conductive layer therein.

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