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    LOW POWER, HIGH SPEED MULTI-CHANNEL CHIP-TO-CHIP INTERFACE USING DIELECTRIC WAVEGUIDE
    1.
    发明申请
    LOW POWER, HIGH SPEED MULTI-CHANNEL CHIP-TO-CHIP INTERFACE USING DIELECTRIC WAVEGUIDE 审中-公开
    低功率，高速多通道芯片到芯片接口使用介质波导

    公开(公告)号：WO2014104536A1

    公开(公告)日：2014-07-03

    申请号：PCT/KR2013/008240

    申请日：2013-09-12

    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

    Inventor： BAE, Hyeon Min ,  JIN, Huxian ,  SONG, Ha Il

    IPC: H01P3/16

    CPC classification number: H01P3/16 ,  H01P3/122 ,  H01P5/107

    Abstract: An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device.

    Abstract translation: 本发明的示例性实施例提供了一种改进的电介质波导，称为电光纤。 具有金属覆层的电光纤可以隔离其它无线信道和相邻电缆中的信号的干扰，这通常导致带限问题，以减小辐射损耗，并且更好的信号导向以降低总的收发机功率消耗，因为传输 距离增加。 此外，电光纤可以具有频率独立的衰减特性，以便由于电光纤和互连设备的垂直耦合而很少或甚至没有任何额外的接收器侧补偿来实现高数据速率传输。

    PRINTED-CIRCUIT BOARD HAVING ANTENNAS AND ELECTROMAGNETIC-TUNNEL-EMBEDDED ARCHITECTURE AND MANUFACTURING METHOD THEREOF
    3.
    发明公开
    PRINTED-CIRCUIT BOARD HAVING ANTENNAS AND ELECTROMAGNETIC-TUNNEL-EMBEDDED ARCHITECTURE AND MANUFACTURING METHOD THEREOF 审中-公开
    具有天线的印刷电路板和电磁隧道嵌入式结构及其制造方法

    公开(公告)号：EP3319167A1

    公开(公告)日：2018-05-09

    申请号：EP17154980.1

    申请日：2017-02-07

    Applicant: Korea Advanced Institute of Science and Technology

    Inventor： PARK, HyoHoon ,  BAE, Hyeon-Min ,  SONG, Ha Il ,  LEE, Daeseong ,  LEE, Harin

    IPC: H01P3/16 ,  H05K1/02 ,  G02B6/12 ,  H01P5/08 ,  H01P5/10 ,  H01P3/12

    CPC classification number: H01Q1/38 ,  G02B6/12 ,  H01P3/121 ,  H01P3/165 ,  H01P5/1022 ,  H01Q9/0485 ,  H05K1/0242 ,  H05K1/0274

    Abstract: Disclosed is a printed circuit board (PCB) structure, in which an electromagnetic signal transmitting antenna and/or an electromagnetic signal receiving antenna, and an electromagnetic signal transferring tunnel (EM-tunnel) are embedded, the PCB structure including a PCB, an EM-tunnel that includes a dielectric core and a metal clad that surrounds the dielectric core and that is embedded in the PCB to be parallel to the PCB, and at least one transmitting antenna and/or at least one receiving antenna that are embedded in the PCB, wherein the transmitting antenna and/or the receiving antenna are arranged at an input port and an output port of the EM-tunnel embedded in the PCB to transmit and receive electromagnetic signals to and from the interior of the EM-tunnel.

    Abstract translation: 公开了一种印刷电路板（PCB）结构，其中嵌入了电磁信号发射天线和/或电磁信号接收天线以及电磁信号传输隧道（EM隧道），所述PCB结构包括PCB，EM 所述通道包括电介质芯和围绕所述电介质芯且覆盖在所述PCB中以平行于所述PCB的金属包层;以及至少一个发射天线和/或至少一个接收天线，所述发射天线和/或至少一个接收天线嵌入在所述PCB 其中所述发射天线和/或所述接收天线被布置在嵌入在所述PCB中的所述EM隧道的输入端口和输出端口处，以向所述EM隧道的内部发射电磁信号并且从所述EM隧道的内部接收电磁信号。

    CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE
    4.
    发明公开
    CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE 审中-公开
    用微带电路和介质波导芯片与芯片的接口

    公开(公告)号：EP3267528A1

    公开(公告)日：2018-01-10

    申请号：EP15884067.8

    申请日：2015-06-02

    Applicant: Korea Advanced Institute of Science and Technology

    Inventor： BAE, Hyeon Min ,  SONG, Ha Il ,  JIN, Huxian

    IPC: H01P3/08

    CPC classification number: H01P5/087 ,  H01P1/20309 ,  H01P3/082 ,  H01P3/16 ,  H01P5/1007

    Abstract: Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.

    Abstract translation: 公开了使用微带电路和电介质波导的芯片到芯片接口。 根据本发明的一个实施例的板间连接装置包括：具有金属包层并将信号从发送器侧板传送到接收器侧板的波导管; 以及连接到所述波导并且具有微带到波导转换（MWT）的微带电路，其中所述微带电路匹配微带线和所述波导，调节所述微带线到所述波导中的预定第一频带的带宽 信号，并将其提供给接收器。

    CONNECTOR FOR COUPLING WAVEGUIDE WITH BOARD
    5.
    发明公开
    CONNECTOR FOR COUPLING WAVEGUIDE WITH BOARD 审中-公开

    公开(公告)号：EP3764460A1

    公开(公告)日：2021-01-13

    申请号：EP19781520.2

    申请日：2019-04-05

    Applicant: Korea Advanced Institute Of Science And Technology

    Inventor： BAE, Hyeon Min ,  SONG, Ha Il

    IPC: H01P5/08 ,  H01P5/18

    Abstract: According to one aspect of the invention, there is provided a connector for connecting a waveguide and a board, comprising: a first opening part formed in a direction perpendicular to one side of a board and coupled to the one side of the board; a second opening part formed in a direction parallel to a longitudinal direction of a waveguide for signal transmission, wherein the waveguide is capable of being coupled to the second opening part; and a signal guide part connecting the first and second opening parts and including a hollowness surrounded by a conductive layer therein.

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