IMAGE CAPTURING MODULE FOR INCREASING ADHESION STRENGTH AND ASSEMBLY FLATNESS
    1.
    发明申请
    IMAGE CAPTURING MODULE FOR INCREASING ADHESION STRENGTH AND ASSEMBLY FLATNESS 审中-公开
    用于增加粘合强度和组装平面的图像捕获模块

    公开(公告)号:US20160006909A1

    公开(公告)日:2016-01-07

    申请号:US14324268

    申请日:2014-07-07

    CPC classification number: H04N5/2257 H04N5/2254

    Abstract: An image capturing module includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The housing frame is disposed on the carrier substrate through a surrounding adhesion structure to surround the image sensing chip. The surrounding adhesion structure includes a surrounding adhesive layer having a uniform thickness and a plurality of spherical particles having the same size. The surrounding adhesive layer is adhesively disposed between the carrier substrate and the housing frame, and each spherical particle is disposed between the carrier substrate and the housing frame and enclosed by the surrounding adhesive layer. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder.

    Abstract translation: 图像拍摄模块包括图像感测单元,壳体框架和致动器结构。 图像感测单元包括载体基板和设置在载体基板上并与载体基板电连接的图像感测芯片。 壳体框架通过周围的粘合结构设置在载体基板上以围绕图像感测芯片。 周围的粘合结构包括具有均匀厚度的周围粘合剂层和具有相同尺寸的多个球形颗粒。 周围的粘合剂层粘合地设置在承载基板和壳体框架之间,并且每个球形颗粒设置在载体基板和壳体框架之间并被周围的粘合剂层包围。 致动器结构包括设置在壳体框架上的透镜保持器和可移动地设置在透镜保持器内部的可移动透镜组件。

    IMAGE CAPTURING MODULE FOR INCREASING ASSEMBLY FLATNESS AND METHOD OF ASSEMBLING THE SAME
    2.
    发明申请
    IMAGE CAPTURING MODULE FOR INCREASING ASSEMBLY FLATNESS AND METHOD OF ASSEMBLING THE SAME 有权
    用于增加装配平面的图像捕获模块及其组装方法

    公开(公告)号:US20160006964A1

    公开(公告)日:2016-01-07

    申请号:US14324296

    申请日:2014-07-07

    Abstract: An image capturing module includes an image sensing unit, a housing frame, an actuator structure and a reflecting material. The image sensing unit includes a carrier substrate and an image sensing chip, and the image sensing chip has a first horizontal top surface on the top side thereof. The housing frame is disposed on the carrier substrate to surround the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. The reflecting material is movably and temporarily placed on the movable lens assembly, and the reflecting material has a second horizontal top surface on the top side thereof. The first horizontal top surface and the second horizontal top surface are horizontal to each other, for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip.

    Abstract translation: 图像捕获模块包括图像感测单元,壳体框架,致动器结构和反射材料。 图像感测单元包括载体基板和图像感测芯片,并且图像感测芯片在其顶侧具有第一水平顶表面。 壳体框架设置在载体基板上以围绕图像感测芯片。 致动器结构包括设置在壳体框架上的透镜保持器和可移动地设置在透镜保持器内部的可移动透镜组件。 反射材料可移动地临时地放置在可移动透镜组件上,并且反射材料在其顶侧具有第二水平顶表面。 第一水平顶表面和第二水平顶表面彼此水平,用于增加可移动透镜组件相对于图像感测芯片的组装平面度。

Patent Agency Ranking