Abstract:
An image capturing module includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The housing frame is disposed on the carrier substrate through a surrounding adhesion structure to surround the image sensing chip. The surrounding adhesion structure includes a surrounding adhesive layer having a uniform thickness and a plurality of spherical particles having the same size. The surrounding adhesive layer is adhesively disposed between the carrier substrate and the housing frame, and each spherical particle is disposed between the carrier substrate and the housing frame and enclosed by the surrounding adhesive layer. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder.
Abstract:
An image capturing module includes an image sensing unit, a housing frame, an actuator structure and a reflecting material. The image sensing unit includes a carrier substrate and an image sensing chip, and the image sensing chip has a first horizontal top surface on the top side thereof. The housing frame is disposed on the carrier substrate to surround the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a movable lens assembly movably disposed inside the lens holder. The reflecting material is movably and temporarily placed on the movable lens assembly, and the reflecting material has a second horizontal top surface on the top side thereof. The first horizontal top surface and the second horizontal top surface are horizontal to each other, for increasing the assembly flatness of the movable lens assembly relative to the image sensing chip.