公开(公告)号：US10207094B2

公开(公告)日：2019-02-19

申请号：US15595891

申请日：2017-05-15

Applicant: MICRODERMICS INC.

Inventor： Boris Stoeber ,  Iman Mansoor ,  Urs Otto Häfeli

IPC: B05D1/36 ,  A61M37/00 ,  B21G1/00 ,  B81C1/00

Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

公开(公告)号：US09675790B2

公开(公告)日：2017-06-13

申请号：US14965536

申请日：2015-12-10

Applicant: MICRODERMICS INC.

Inventor： Boris Stoeber ,  Iman Mansoor ,  Urs Otto Häfeli

IPC: A61M37/00 ,  B05D1/36 ,  B29C33/60 ,  B21G1/00 ,  B81C1/00

CPC classification number: A61M37/0015 ,  A61M2037/0023 ,  A61M2037/003 ,  A61M2037/0053 ,  B05D1/36 ,  B05D2201/06 ,  B21G1/00 ,  B81C1/00111

Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

公开(公告)号：US10589078B2

公开(公告)日：2020-03-17

申请号：US16238457

申请日：2019-01-02

Applicant: MICRODERMICS INC.

Inventor： Boris Stoeber ,  Iman Mansoor ,  Urs Otto Häfeli

IPC: A61M37/00 ,  B21G1/00 ,  B05D1/36 ,  B81C1/00

Abstract: Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

公开(公告)号：US20200078575A1

公开(公告)日：2020-03-12

申请号：US16575301

申请日：2019-09-18

Applicant: Microdermics Inc.

Inventor： Iman Mansoor ,  Sahan Anupama Ranamukhaarachchi ,  Mehrsa Raeiszadeh ,  Boris Stoeber

IPC: A61M37/00

Abstract: Methods and apparatus for supporting microneedles are provided. The apparatus includes a plurality of pedestals extending away from a base and transversely spaced-apart from each other by inter-pedestal volumes. Each of the pedestals has a transversely extending contact surface. For each of the pedestals, one or more microneedles extend from the contact surface of the pedestal.