公开(公告)号：WO2022268427A1

公开(公告)日：2022-12-29

申请号：PCT/EP2022/064137

申请日：2022-05-25

Applicant: MEMJET TECHNOLOGY LIMITED

Inventor： HUDSON, Michael ,  BURKE, David ,  CHEN, Qing ,  LOWE, Graeme ,  THELANDER, Jason ,  MUNTON, Ellaine

IPC: B41J2/14 ,  B41J2/18 ,  B41J2/04531 ,  B41J2/145 ,  B41J2/175 ,  B41J2002/14362 ,  B41J2002/14419 ,  B41J2202/08 ,  B41J2202/20 ,  B41J2202/21

Abstract: An inkjet printing system includes: (a) an inkjet printhead having a rigid elongate manifold with first and second parallel ink supply channels extending along a length of the manifold between respective ink ports positioned at opposite ends thereof; and a plurality of printhead chips mounted to a lower surface of the manifold, the ink supply channels supplying ink to the printhead chips via ink outlets defined in the lower surface. One end of the manifold has a first ink inlet port for the first ink supply channel and an ink outlet port for the second ink supply channel. The other end of the manifold has a first ink outlet port for the first ink supply channel and a second ink inlet port for the second ink supply channel. An ink delivery system is configured to flow ink along the first and second channels in opposite directions.

公开(公告)号：WO2019211070A1

公开(公告)日：2019-11-07

申请号：PCT/EP2019/059174

申请日：2019-04-11

Applicant: MEMJET TECHNOLOGY LIMITED

Inventor： PEREZ, Elmer Dimaculangan ,  NORTH, Angus ,  LOWE, Graeme ,  TAN, See-Huat ,  BARTON, Christopher

IPC: B41J2/14

Abstract: A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.

公开(公告)号：EP3758944A1

公开(公告)日：2021-01-06

申请号：EP19717838.7

申请日：2019-04-11

Applicant: Memjet Technology Limited

Inventor： PEREZ, Elmer Dimaculangan ,  NORTH, Angus ,  LOWE, Graeme ,  TAN, See-Huat ,  BARTON, Christopher

IPC: B41J2/14