公开(公告)号：KR20180066096A

公开(公告)日：2018-06-18

申请号：KR20187010264

申请日：2016-10-14

Applicant: QUALCOMM INC

Inventor： PANCHAWAGH HRISHIKESH VIJAYKUMAR ,  GANTI SURYAPRAKASH ,  DJORDJEV KOSTADIN DIMITROV ,  BURNS DAVID WILLIAM ,  DICKINSON TIMOTHY ALAN ,  KIDWELL JR DONALD WILLIAM ,  SHENOY RAVINDRA VAMAN ,  LASITER JON BRADLEY ,  TANG HAO YEN ,  LU YIPENG

IPC: H01L41/09 ,  B06B1/02 ,  B06B1/06 ,  G01S7/52 ,  G06F3/043 ,  G06K9/00 ,  H01L27/12 ,  H01L27/20 ,  H01L41/083 ,  H01L41/113 ,  H01L41/311

CPC classification number: H01L27/20 ,  B06B1/0207 ,  B06B1/0607 ,  G01S7/52028 ,  G06F3/0436 ,  G06K9/0002 ,  H01L27/1214 ,  H01L41/1132 ,  H01L41/311

Abstract: 초음파센서픽셀은, 기판, 압전마이크로기계식초음파트랜스듀서(PMUT), 및센서픽셀회로를포함한다. PMUT는, 캐비티위에배치된압전층을포함하는압전층 스택― 캐비티는압전층 스택과기판사이에배치됨―; 압전층과캐비티사이에배치되는기준전극; 및압전층의제1 표면상에또는그에근접하게배치되는수신전극및 송신전극중 하나또는둘 모두를포함하며, 제1 표면은캐비티에대향한다. 센서픽셀회로는기준전극, 수신전극, 및송신전극중 하나이상과전기적으로커플링되고, PMUT 및센서픽셀회로는기판상의센서픽셀회로와통합된다.

公开(公告)号：AU2017313749A1

公开(公告)日：2019-01-31

申请号：AU2017313749

申请日：2017-08-16

Applicant: QUALCOMM INC

Inventor： SHENOY RAVINDRA ,  SAUHTA ROHIT ,  MCLAREN ELBERT ,  SITACHITT SIDNEY ,  KIDWELL JR DONALD WILLIAM

IPC: H04R1/10 ,  H04R25/00

Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.

公开(公告)号：AU2017313749B2

公开(公告)日：2022-02-03

申请号：AU2017313749

申请日：2017-08-16

Applicant: QUALCOMM INC

Inventor： SHENOY RAVINDRA ,  SAUHTA ROHIT ,  MCLAREN ELBERT ,  SITACHITT SIDNEY ,  KIDWELL JR DONALD WILLIAM

IPC: H04R1/10 ,  H04R25/00

Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.