公开(公告)号：AU2017313749A1

公开(公告)日：2019-01-31

申请号：AU2017313749

申请日：2017-08-16

Applicant: QUALCOMM INC

Inventor： SHENOY RAVINDRA ,  SAUHTA ROHIT ,  MCLAREN ELBERT ,  SITACHITT SIDNEY ,  KIDWELL JR DONALD WILLIAM

IPC: H04R1/10 ,  H04R25/00

Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.

公开(公告)号：SG11201900186QA

公开(公告)日：2019-03-28

申请号：SG11201900186Q

申请日：2017-08-16

Applicant: QUALCOMM INC

Inventor： SHENOY RAVINDRA ,  SAUHTA ROHIT ,  MCLAREN ELBERT ,  SITACHITT SIDNEY ,  KIDWELL DONALD WILLIAM JR

IPC: H04R1/10 ,  H04R25/00

Abstract: A device comprising a first printed circuit board (PCB); a second printed circuit board (PCB); a first flex board coupled to the first PCB and the second PCB; a first integrated device coupled to the first PCB; a speaker configured to be coupled to the first integrated device; a microphone configured to be coupled to the first integrated device; a second integrated device coupled to the second PCB, wherein the second integrated device is configured to be coupled to the first integrated device through the second PCB, the first flex board and the first PCB; and a power source configured to provide power to the first integrated device and the second integrated device. The first PCB is located between the power source and the first integrated device. The second PCB is located between the power source and the second integrated device.

公开(公告)号：AU2017313749B2

公开(公告)日：2022-02-03

申请号：AU2017313749

申请日：2017-08-16

Applicant: QUALCOMM INC

Inventor： SHENOY RAVINDRA ,  SAUHTA ROHIT ,  MCLAREN ELBERT ,  SITACHITT SIDNEY ,  KIDWELL JR DONALD WILLIAM

IPC: H04R1/10 ,  H04R25/00

Abstract: A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.

公开(公告)号：SG11201705347RA

公开(公告)日：2017-08-30

申请号：SG11201705347R

申请日：2016-02-03

Applicant: QUALCOMM INC

Inventor： KIDWELL DONALD WILLIAM JR ,  SHENOY RAVINDRA ,  ERTURK METE ,  ROUHANA LAYAL

IPC: H01F17/00 ,  H01L23/498 ,  H01L21/48

Abstract: An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg layer), a magnetic core in the dielectric layer, a first plurality of interconnects configured to operate as a first protective ring, and a second plurality of interconnects configured to operate as a first inductor. The second plurality of interconnects is positioned in the package substrate to at least partially surround the magnetic core. At least one interconnect from the second plurality of interconnects is also part of the first plurality of interconnects. In some implementations, the first protective ring is a non-contiguous protective ring. In some implementations, the first inductor is a solenoid inductor. In some implementations, the magnetic core includes a carrier, a first magnetic layer, and a second magnetic layer.