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公开(公告)号：WO2007059391A2
公开(公告)日：2007-05-24
申请号：PCT/US2006/060604
申请日：2006-11-07
Applicant: RCD TECHNOLOGY INC. , GARBY, Sandra, M. , OBERLE, Robert, R.
Inventor： GARBY, Sandra, M. , OBERLE, Robert, R.
CPC classification number: H01Q1/36 , H01Q1/2208 , H01Q7/00 , H05K1/095 , H05K1/165 , H05K3/048 , H05K3/242 , H05K3/246 , H05K2201/0347 , H05K2203/054 , H05K2203/0574 , H05K2203/175 , Y10T29/49016
Abstract: A two resist layer process allows a seed layer to be used to electroplate a conductive layer of an element in a way that a portion of the seed layer can be removed.
Abstract translation: 两种抗蚀剂层工艺允许种子层被用来电镀元件的导电层，使得种子层的一部分可被去除。
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公开(公告)号：EP1949493A2
公开(公告)日：2008-07-30
申请号：EP06846245.6
申请日：2006-11-07
Applicant: RCD TECHNOLOGY INC.
Inventor： GARBY, Sandra, M. , OBERLE, Robert, R.
CPC classification number: H01Q1/36 , H01Q1/2208 , H01Q7/00 , H05K1/095 , H05K1/165 , H05K3/048 , H05K3/242 , H05K3/246 , H05K2201/0347 , H05K2203/054 , H05K2203/0574 , H05K2203/175 , Y10T29/49016
Abstract: A two resist layer process allows a seed layer to be used to electroplate a conductive layer of an element in a way that a portion of the seed layer can be removed.
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