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公开(公告)号:US20170095993A1
公开(公告)日:2017-04-06
申请号:US15128765
申请日:2015-03-10
Applicant: RIKEN TECHNOS CORPORATION
Inventor: Hiroyuki TOMOMATSU , Taketo HASHIMOTO
CPC classification number: B32B7/02 , B29C47/065 , B32B1/00 , B32B7/12 , B32B27/06 , B32B27/08 , B32B27/16 , B32B27/281 , B32B27/30 , B32B27/308 , B32B27/34 , B32B27/365 , B32B37/12 , B32B38/0004 , B32B38/0008 , B32B2250/24 , B32B2250/40 , B32B2255/10 , B32B2255/26 , B32B2307/412 , B32B2307/418 , B32B2307/536 , B32B2307/546 , B32B2307/554 , B32B2307/58 , B32B2307/734 , B32B2457/208 , G02B1/14 , G06F2203/04103
Abstract: The present invention pertains to a process for producing an article from a layered hard coat object including a hard coat layer and a transparent-resin film layer in this order from the outermost layer side, the process comprising: a step (A) in which a pressure-sensitive adhesive layer of a support having the pressure-sensitive adhesive layer on at least one surface thereof is temporarily applied to at least one surface of the layered hard coat object to obtain a temporarily support-bearing layered hard coat object; a step (B) in which at least one processing method selected from the group consisting of router processing, water-jet processing, laser processing, and punching is applied to the temporarily support-bearing layered hard coat object to cut the temporarily support-bearing layered hard coat object into a given shape, thereby obtaining a temporarily support-bearing cut article; and a step (C) in which at least one kind of energy selected from the group consisting of heat and actinic rays is applied to the temporarily support-bearing cut article to reduce the strength of tackiness between the support and the article to 2 N/2.5 cm or less.
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公开(公告)号:US20170259379A1
公开(公告)日:2017-09-14
申请号:US15510043
申请日:2015-08-05
Applicant: RIKEN TECHNOS CORPORATION
Inventor: Taketo HASHIMOTO , Hiroyuki TOMOMATSU
CPC classification number: B23K26/18 , B23K26/38 , B32B37/06 , B32B37/26 , B32B38/0004 , B32B38/10 , B32B2307/402 , B32B2310/0843
Abstract: Embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B) a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the protective films have an absorbance of 50% or more. Other embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B′) a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the film to be processed has an absorbance of 50% or more and the protective films have an absorbance of 50% or more.
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