公开(公告)号：WO2008060389A3

公开(公告)日：2008-12-24

申请号：PCT/US2007022336

申请日：2007-10-19

Applicant: S3C INC ,  DANGTRAN JOHN

Inventor： DANGTRAN JOHN

IPC: B81B7/00

CPC classification number: G01P1/023 ,  G01D11/245

Abstract: A sensor device and a method of forming thereof comprises a die pad having an inner portion and an outer portion. The outer portion is made of steel, aluminum or other metal and is adapted to mount the die pad to a support structure having a first coefficient of thermal expansion (CTE) value and provide a hermetic seal therewith. The outer portion is made of a material having a CTE value substantially complaint with the first CTE value. The inner portion may be made of Invar, Kovar or ceramic material to receive a MEMS device having a second CTE value. The inner portion is made of a material having a CTE value substantially compliant with the second CTE value. The outer portion has a thickness less than that of the inner portion. The die pad may include a trench between outer edges of the outer and inner portions.

Abstract translation: 传感器装置及其形成方法包括具有内部和外部的管芯垫。 外部由钢，铝或其他金属制成，并且适于将管芯焊盘安装到具有第一热膨胀系数（CTE）值的支撑结构上并与其形成气密密封。 外部由CTE值基本上与第一CTE值相符的材料制成。 内部可由Invar，Kovar或陶瓷材料制成以接收具有第二CTE值的MEMS器件。 内部由具有基本上符合第二CTE值的CTE值的材料制成。 外部的厚度小于内部的厚度。 管芯焊盘可以包括在外部和内部部分的外边缘之间的沟槽。

公开(公告)号：WO2007117447A3

公开(公告)日：2007-12-27

申请号：PCT/US2007008278

申请日：2007-03-30

Applicant: S3C INC ,  DANGTRAN JOHN ,  HORTON ROGER

Inventor： DANGTRAN JOHN ,  HORTON ROGER

IPC: B81B7/00

CPC classification number: B81B7/0048 ,  H01L2924/19105

Abstract: A low cost micro-electronic package for MEMS applications includes a package substrate, a MEMS device and a buffer insert which is placed between the MEMS device and the package substrate. The buffer insert has a coefficient of thermal expansion (CTE) which is compatible with the material of the MEMS device and is sufficiently rigid to isolate the MEMS device from thermal, mechanical and other physical stresses applied to the package substrate. In an embodiment, the package is formed as an integrated device which includes both the MEMS device and a signal conditioning integrated circuit, potentially found in the same die. The substrate insert may be made of a material having a CTE value compatible with silicon (Si), such as Kovar, Invar, or an appropriate ceramic material or the like.

Abstract translation: 用于MEMS应用的低成本微电子封装包括封装衬底，MEMS器件和放置在MEMS器件和封装衬底之间的缓冲插入件。 缓冲插入件具有与MEMS器件的材料兼容的热膨胀系数（CTE），并且具有足够的刚度以将MEMS器件与施加到封装衬底的热，机械和其他物理应力隔离。 在一个实施例中，封装被形成为集成器件，其包括可能在相同管芯中的MEMS器件和信号调节集成电路两者。 衬底插入物可以由具有与硅（Si）相容的CTE值的材料制成，例如Kovar，Invar或适当的陶瓷材料等。

公开(公告)号：EP2316008A4

公开(公告)日：2016-01-27

申请号：EP09808902

申请日：2009-08-21

Applicant: S3C INC

Inventor： DANGTRAN JOHN ,  HORTON ROGER

IPC: G01L9/06 ,  B81B7/00

CPC classification number: B81B7/0077 ,  B81B7/0019

Abstract: A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.