公开(公告)号：WO2007117447A3

公开(公告)日：2007-12-27

申请号：PCT/US2007008278

申请日：2007-03-30

Applicant: S3C INC ,  DANGTRAN JOHN ,  HORTON ROGER

Inventor： DANGTRAN JOHN ,  HORTON ROGER

IPC: B81B7/00

CPC classification number: B81B7/0048 ,  H01L2924/19105

Abstract: A low cost micro-electronic package for MEMS applications includes a package substrate, a MEMS device and a buffer insert which is placed between the MEMS device and the package substrate. The buffer insert has a coefficient of thermal expansion (CTE) which is compatible with the material of the MEMS device and is sufficiently rigid to isolate the MEMS device from thermal, mechanical and other physical stresses applied to the package substrate. In an embodiment, the package is formed as an integrated device which includes both the MEMS device and a signal conditioning integrated circuit, potentially found in the same die. The substrate insert may be made of a material having a CTE value compatible with silicon (Si), such as Kovar, Invar, or an appropriate ceramic material or the like.

Abstract translation: 用于MEMS应用的低成本微电子封装包括封装衬底，MEMS器件和放置在MEMS器件和封装衬底之间的缓冲插入件。 缓冲插入件具有与MEMS器件的材料兼容的热膨胀系数（CTE），并且具有足够的刚度以将MEMS器件与施加到封装衬底的热，机械和其他物理应力隔离。 在一个实施例中，封装被形成为集成器件，其包括可能在相同管芯中的MEMS器件和信号调节集成电路两者。 衬底插入物可以由具有与硅（Si）相容的CTE值的材料制成，例如Kovar，Invar或适当的陶瓷材料等。

公开(公告)号：EP2316008A4

公开(公告)日：2016-01-27

申请号：EP09808902

申请日：2009-08-21

Applicant: S3C INC

Inventor： DANGTRAN JOHN ,  HORTON ROGER

IPC: G01L9/06 ,  B81B7/00

CPC classification number: B81B7/0077 ,  B81B7/0019

Abstract: A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.

公开(公告)号：EP2783395A4

公开(公告)日：2015-09-02

申请号：EP12851847

申请日：2012-11-07

Applicant: S3C INC

Inventor： NZEADIBE IHIOMA U ,  HUSSAIN JAVED ,  CASTAGNA JOSEPH ,  YUAN LI ,  HORTON ROGER

IPC: H01L29/84

CPC classification number: G01L23/26 ,  F02D35/023 ,  F02D2400/22 ,  G01L19/0084

Abstract: The present invention disclosed provides for a rugged, compact sensing device for various implementations including those of automotive, marine, and other combustion technologies that require low cost accurate pressure sensing during internal combustion engine process. In one or more aspects of the present invention, a MEMS sensor connection with a flexible circuit is presented and the communication of which is preferably achieved through the use of wire bond technology.

Abstract translation: 所公开的本发明提供了用于各种实现的坚固，紧凑的感测装置，包括在内燃机过程中需要低成本精确的压力感测的汽车，船舶和其他燃烧技术。 在本发明的一个或多个方面，提出了一种具有柔性电路的MEMS传感器连接，其通信优选通过使用引线键合技术实现。

公开(公告)号：EP2567401A4

公开(公告)日：2013-12-25

申请号：EP11778212

申请日：2011-05-03

Applicant: S3C INC

Inventor： HORTON ROGER ,  HUSSAIN JAVED

IPC: B81C1/00 ,  H01L23/58

CPC classification number: B81B7/0058 ,  B81C1/00888 ,  B81C2201/053 ,  G01L9/0055 ,  H01L21/78

Abstract: A method for separating a plurality of dies on a Micro-Electro-Mechanical System (MEMS) wafer comprising scribing a notch on a first side of the wafer between at least two of the plurality of dies on a first surface and depositing a metal on the first surface of the plurality of dies. The method further comprises scribing a second side of the wafer between at least two of the plurality of dies from a second surface thereof through the notch. The first side and second side are substantially parallel and opposite each other and the first surface and the second surface are substantially parallel and opposite each other. In a process in accordance with the present invention, a method to minimize chipping of the bonding portion of a MEMs device during sawing of the wafer is provided, which minimally affects the process steps associated with separating the die on a wafer.

Abstract translation: 一种用于在微电子机械系统（MEMS）晶片上分离多个裸片的方法，包括在第一表面上的多个裸片中的至少两个裸片之间在晶片的第一侧上划刻凹口，并且在第一表面上沉积金属 多个管芯的第一表面。 所述方法进一步包括在所述多个管芯中的至少两个之间从其第二表面通过所述凹口划刻所述晶片的第二侧。 第一侧面和第二侧面基本平行并且彼此相对，并且第一表面和第二表面基本平行且彼此相对。 在根据本发明的工艺中，提供了一种在锯切晶片期间最小化MEMS器件的键合部分的碎裂的方法，其最小程度地影响与将晶粒分离在晶片上相关的工艺步骤。