公开(公告)号：EP2210966B1

公开(公告)日：2011-07-13

申请号：EP10275006.4

申请日：2010-01-25

Applicant: SPP Process Technology Systems UK Limited

Inventor： Carruthers, Mark ,  Burgess, Stephen ,  Wilby, Anthony ,  Rastogi, Amit ,  Rich, Paul ,  Rimmer, Nicholas

IPC: C23C14/35

CPC classification number: C23C14/046 ,  C23C14/35 ,  H01J37/3405 ,  H01L21/2855 ,  H01L21/76843 ,  H01L21/76865 ,  H01L21/76873

公开(公告)号：EP2210966A1

公开(公告)日：2010-07-28

申请号：EP10275006.4

申请日：2010-01-25

Applicant: SPP Process Technology Systems UK Limited

Inventor： Carruthers, Mark ,  Burgess, Stephen ,  Wilby, Anthony ,  Rastogi, Amit ,  Rich, Paul ,  Rimmer, Nicholas

IPC: C23C14/35

CPC classification number: C23C14/046 ,  C23C14/35 ,  H01J37/3405 ,  H01L21/2855 ,  H01L21/76843 ,  H01L21/76865 ,  H01L21/76873

Abstract: This invention consists of a method of plasma vapour deposition of metal into a recess in a workpiece. The method achieves re-sputtering of the metal at the base of the recess with a sputter gas by utilising a mixture of Ar and He and/or Ne as the sputter gas with a ratio of He and/or Ne:Ar of at least about 10:1.

Abstract translation: 本发明包括将金属等离子体气相沉积到工件凹陷中的方法。 该方法通过利用Ar和He和/或Ne的混合物作为溅射气体，以He和/或Ne：Ar的比例至少约为 10：1。