公开(公告)号：SG138494A1

公开(公告)日：2008-01-28

申请号：SG2006043921

申请日：2006-06-27

Applicant: ST MICROELECTRONICS ASIA

Inventor： YONG GOH KIM ,  EN LUAN JING

Abstract: The present invention provides a reinforcement frame (50, 150, 200) operable for mounting onto a peripheral area around an interconnect pattern of a surface-mount semiconductor device (10) and a method of improving the solder joint reliability of a semiconductor package mountable on a printed circuit board (PCB) or circuit substrate.

公开(公告)号：SG132533A1

公开(公告)日：2007-06-28

申请号：SG2005072855

申请日：2005-11-21

Applicant: ST MICROELECTRONICS ASIA

Inventor： YONG GOH KIM ,  YAN TEE TONG