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公开(公告)号：SG138494A1
公开(公告)日：2008-01-28
申请号：SG2006043921
申请日：2006-06-27
Applicant: ST MICROELECTRONICS ASIA
Inventor： YONG GOH KIM , EN LUAN JING
Abstract: The present invention provides a reinforcement frame (50, 150, 200) operable for mounting onto a peripheral area around an interconnect pattern of a surface-mount semiconductor device (10) and a method of improving the solder joint reliability of a semiconductor package mountable on a printed circuit board (PCB) or circuit substrate.
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