公开(公告)号：US09986631B2

公开(公告)日：2018-05-29

申请号：US15081464

申请日：2016-03-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Rizza ,  Agatino Minotti ,  Gaetano Montalto ,  Francesco Salamone

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/373 ,  H01L23/498 ,  H01L23/538 ,  H01L25/07 ,  H01L23/053 ,  H01L23/08 ,  H01L23/29 ,  H01L23/31 ,  H01L23/34 ,  H01L23/367 ,  H01L23/00 ,  H01L25/18 ,  H01L25/00 ,  H05K1/11 ,  H05K3/10 ,  H05K7/14 ,  H05K13/00 ,  H01L23/24 ,  H01L23/36 ,  H01L23/473 ,  H01L23/492

CPC classification number: H05K1/0203 ,  H01L23/053 ,  H01L23/08 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/27 ,  H01L24/33 ,  H01L24/83 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/29139 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/19107 ,  H05K1/115 ,  H05K3/10 ,  H05K7/1427 ,  H05K13/00 ,  H05K2201/06

Abstract: An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.

公开(公告)号：US20170064808A1

公开(公告)日：2017-03-02

申请号：US15081464

申请日：2016-03-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Rizza ,  Agatino Minotti ,  Gaetano Montalto ,  Francesco Salamone

IPC: H05K1/02 ,  H05K13/00 ,  H05K3/10 ,  H05K1/11 ,  H01L23/00 ,  H01L25/18 ,  H01L23/367 ,  H01L23/492 ,  H01L23/34 ,  H01L25/00 ,  H01L23/08 ,  H01L23/053 ,  H01L23/373 ,  H01L23/31 ,  H01L23/29 ,  H05K7/14

CPC classification number: H05K1/0203 ,  H01L23/053 ,  H01L23/08 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/27 ,  H01L24/33 ,  H01L24/83 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/29139 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/19107 ,  H05K1/115 ,  H05K3/10 ,  H05K7/1427 ,  H05K13/00 ,  H05K2201/06

Abstract: An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.

Abstract translation: 一种电子电源模块，包括容纳堆叠的壳体，其包括：DBC型等的第一衬底; 集成了具有一个或多个导电端子的电子部件，机电和热耦合到第一基板; 以及DBC型等的第二基板，其在第一基板上延伸并且在模具上方并且呈现面向模具的导电路径。 模具通过烧结的导热浆的第一耦合区域机械地和热耦合到第一衬底，并且电子部件的一个或多个导电端子通过机械，电和热耦合到第二衬底的导电路径，由 烧结导热浆的第二耦合区域。

公开(公告)号：US10756002B2

公开(公告)日：2020-08-25

申请号：US16239333

申请日：2019-01-03

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Cristiano Gianluca Stella ,  Francesco Salamone

IPC: H01L23/473 ,  H01L23/367 ,  H01L23/433 ,  H01L23/04 ,  H01L23/40 ,  H01L23/373

Abstract: A packaged device, having a package, including a first dissipative region, a second dissipative region, a first connection element and a second connection element. A die of semiconductor material is arranged within the package, carried by the first dissipative region. The first and second dissipative regions extend at a distance from each other, and the first and second connection elements extend at a distance from each other between the first and second dissipative regions. The first dissipative region, the second dissipative region, the first connection element, and the second connection element are hollow and form a circuit containing a cooling liquid.

公开(公告)号：US09570380B2

公开(公告)日：2017-02-14

申请号：US14870721

申请日：2015-09-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Fabio Vito Coppone ,  Agatino Minotti ,  Francesco Salamone

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/49562 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49568 ,  H01L24/06 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/84 ,  H01L2924/00

Abstract: An electronic device comprising: a semiconductor die integrating an electronic component; a leadframe housing the semiconductor die; a protection body, which surrounds laterally and at the top the semiconductor die and, at least in part, the leadframe structure, defining a top surface, a bottom surface, and a thickness of the electronic device; and a conductive lead electrically coupled to the semiconductor die. The conductive lead is modelled in such a way as to extend throughout the thickness of the protection body for forming a front electrical contact accessible from the top surface of the electronic device, and a rear electrical contact accessible from the bottom surface of the electronic device.

Abstract translation: 一种电子设备，包括：集成电子部件的半导体管芯; 引线框架，其容纳半导体管芯; 保护体，其横向地和顶部包围半导体管芯，并且至少部分地围绕引线框架结构，限定电子器件的顶表面，底表面和厚度; 以及电连接到半导体管芯的导电引线。 导电引线被模制成能够延伸到保护体的整个厚度上，以形成从电子器件的顶表面可接近的前电接触，以及可从电子器件的底表面接近的后电接触。

公开(公告)号：US11864361B2

公开(公告)日：2024-01-02

申请号：US16934991

申请日：2020-07-21

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca Stella ,  Francesco Salamone

IPC: H05K7/20 ,  H01L23/373 ,  H01L25/07

CPC classification number: H05K7/209 ,  H01L23/3735 ,  H01L25/071

Abstract: The device has a first support element forming a first thermal dissipation surface and carrying a first power component; a second support element forming a second thermal dissipation surface and carrying a second power component, a first contacting element superimposed to the first power component; a second contacting element superimposed to the second power component; a plurality of leads electrically coupled with the power components through the first and/or the second support elements; and a thermally conductive body arranged between the first and the second contacting elements. The first and the second support elements and the first and the second contacting elements are formed by electrically insulating and thermally conductive multilayers.

公开(公告)号：US11562950B2

公开(公告)日：2023-01-24

申请号：US17227030

申请日：2021-04-09

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca Stella ,  Fabio Vito Coppone ,  Francesco Salamone

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/34 ,  H01L23/28 ,  H01L21/00 ,  H05K7/20 ,  H05K7/18 ,  H01L23/31 ,  H01L23/00

Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.

公开(公告)号：US11239132B2

公开(公告)日：2022-02-01

申请号：US16894460

申请日：2020-06-05

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Francesco Salamone ,  Cristiano Gianluca Stella

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48 ,  H01L23/433 ,  H01L23/495 ,  H01L23/373 ,  H01L23/48 ,  H01L23/34 ,  H01L23/36 ,  H01L23/42 ,  H01L23/28

Abstract: A semiconductor power device has: a die, with a front surface and a rear surface, and with an arrangement of projecting regions on the front surface, which define between them windows arranged within which are contact regions; and a package, which houses the die inside it. A metal frame has a top surface and a bottom surface; the die is carried by the frame on the top surface; an encapsulation coating coats the frame and the die. A first insulation multilayer is arranged above the die and is formed by an upper metal layer, a lower metal layer, and an intermediate insulating layer; the lower metal layer is shaped according to an arrangement of the projecting regions and has contact projections, which extend so as to electrically contact the contact regions, and insulation regions, interposed between the contact projections, in positions corresponding to the projecting regions.

公开(公告)号：US12295128B2

公开(公告)日：2025-05-06

申请号：US18395137

申请日：2023-12-22

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca Stella ,  Francesco Salamone

IPC: H05K7/20 ,  H01L23/373 ,  H01L25/07

Abstract: The device has a first support element forming a first thermal dissipation surface and carrying a first power component; a second support element forming a second thermal dissipation surface and carrying a second power component, a first contacting element superimposed to the first power component; a second contacting element superimposed to the second power component; a plurality of leads electrically coupled with the power components through the first and/or the second support elements; and a thermally conductive body arranged between the first and the second contacting elements. The first and the second support elements and the first and the second contacting elements are formed by electrically insulating and thermally conductive multilayers.

公开(公告)号：US12230555B2

公开(公告)日：2025-02-18

申请号：US18395122

申请日：2023-12-22

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Cristiano Gianluca Stella ,  Fabio Vito Coppone ,  Francesco Salamone

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.

公开(公告)号：US20130328180A1

公开(公告)日：2013-12-12

申请号：US13909166

申请日：2013-06-04

Applicant: STMicroelectronics S.r.l.

Inventor： Francesco Salamone

IPC: H01L23/34 ,  H01L21/56

CPC classification number: H01L23/34 ,  H01L21/56 ,  H01L23/4334 ,  H01L23/49524 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40247 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: In a manufacturing technique for packaged semiconductor devices, a pre-form of a packaged semiconductor device is formed by a molding process which encapsulates the semiconductor device and its associated heat transfer component in a passivating material presenting a surface. The surface is then processed to at least remove excess passivating material and expose the heat transfer component. The processing may further remove a portion of the heat transfer component. The removal process may, for example, utilize a grinding and/or polishing process. The process may be controlled so as to expose or form a heat transfer surface of desired shape and size.

Abstract translation: 在封装半导体器件的制造技术中，通过将半导体器件及其相关联的传热部件封装在呈现表面的钝化材料中的成型工艺形成封装半导体器件的预成型件。 然后处理表面以至少去除过量的钝化材料并暴露传热组件。 处理可以进一步去除传热部件的一部分。 除去过程可以例如利用研磨和/或抛光方法。 可以控制该过程以暴露或形成所需形状和尺寸的传热表面。