Abstract:
A ferro-electric memory cell includes: a ferro-electric capacitor (80), having a first electrode (72a) and a second electrode (75a), and a ferro-electric region (73a) arranged between the first electrode (72a) and the second electrode (75a); and a selector (51), associated to the ferro-electric capacitor (80) and having conduction regions (62, 63), formed in an active area (53) of a semiconductor body (50), and a control region (58c), raised with respect to the conduction regions (62, 63). The ferro-electric capacitor (80) is arranged adjacent to at least one side (58a, 58b) of the control region (58c).
Abstract:
A memory cell (30) of a stacked type is formed by a MOS transistor (32) and a ferroelectric capacitor (33). The MOS transistor (32) is formed in an active region (40) of a substrate (30) of semiconductor material and comprises a conductive region (34a). The ferroelectric capacitor (33) is formed on top of the active region and comprises a first and a second electrodes (45, 47) separated by a ferroelectric region (46). A contact region (44a) connects the conductive region (34a) of the MOS transistor to the first electrode (45) of the ferroelectric capacitor (33). The ferroelectric capacitor (33) has a non-planar structure, formed by a horizontal portion (45) and two side portions (48) extending transversely to, and in direct electrical contact with, the horizontal portion.