Three - dimensional ferro-electric memory cell and manufacturing process thereof
    1.
    发明公开

    公开(公告)号:EP1501128A1

    公开(公告)日:2005-01-26

    申请号:EP03425494.6

    申请日:2003-07-23

    Inventor: Artoni, Cesare

    Abstract: A ferro-electric memory cell includes: a ferro-electric capacitor (80), having a first electrode (72a) and a second electrode (75a), and a ferro-electric region (73a) arranged between the first electrode (72a) and the second electrode (75a); and a selector (51), associated to the ferro-electric capacitor (80) and having conduction regions (62, 63), formed in an active area (53) of a semiconductor body (50), and a control region (58c), raised with respect to the conduction regions (62, 63). The ferro-electric capacitor (80) is arranged adjacent to at least one side (58a, 58b) of the control region (58c).

    Abstract translation: 铁电存储单元包括:具有第一电极(72a)和第二电极(75a)的铁电电容器(80)和布置在第一电极(72a)和第二电极(75a)之间的铁电区域 第二电极(75a); 和形成在半导体本体(50)的有源区域(53)中的具有导电区域(62,63)的与铁电电容器(80)相关联的选择器(51)和控制区域(58c) 相对于导电区域(62,63)升高。 铁电电容器80布置成与控制区域58c的至少一个侧面58a,58b相邻。

    Capacitor for semiconductor integrated devices
    2.
    发明公开
    Capacitor for semiconductor integrated devices 有权
    Kondensatorfürintegrierte Halbleiterbauelemente

    公开(公告)号:EP1324392A1

    公开(公告)日:2003-07-02

    申请号:EP01830821.3

    申请日:2001-12-28

    Abstract: A memory cell (30) of a stacked type is formed by a MOS transistor (32) and a ferroelectric capacitor (33). The MOS transistor (32) is formed in an active region (40) of a substrate (30) of semiconductor material and comprises a conductive region (34a). The ferroelectric capacitor (33) is formed on top of the active region and comprises a first and a second electrodes (45, 47) separated by a ferroelectric region (46). A contact region (44a) connects the conductive region (34a) of the MOS transistor to the first electrode (45) of the ferroelectric capacitor (33). The ferroelectric capacitor (33) has a non-planar structure, formed by a horizontal portion (45) and two side portions (48) extending transversely to, and in direct electrical contact with, the horizontal portion.

    Abstract translation: 堆叠型存储单元(30)由MOS晶体管(32)和强电介质电容器(33)形成。 MOS晶体管(32)形成在半导体材料的衬底(30)的有源区(40)中并且包括导电区(34a)。 铁电电容器(33)形成在有源区的顶部,并且包括由铁电区(46)分开的第一和第二电极(45,47)。 接触区域(44a)将MOS晶体管的导电区域(34a)与铁电体电容器(33)的第一电极(45)连接。 铁电电容器(33)具有由水平部分(45)和与水平部分横向并直接电接触延伸的两个侧部(48)形成的非平面结构。

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