公开(公告)号：EP4239304A1

公开(公告)日：2023-09-06

申请号：EP23154638.3

申请日：2023-02-02

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  DANIELE, Filippo ,  BALDO, Lorenzo ,  CAPELLI, Giulio ,  ALONGI, Salvatore

IPC: G01L19/04 ,  G01L19/14 ,  G01L9/00

Abstract: A pressure sensor device (1) is provided with: a pressure detection structure (2) made in a first die (4) of semiconductor material; a package (20), configured to internally accommodate the pressure detection structure (2) in an impermeable manner, the package (20) having a base structure (21) and a body structure (22), arranged on the base structure (21), with an access opening (30) in contact with an external environment and internally defining a housing cavity (23), in which the first die (4) is arranged covered with a coating material (32). The pressure sensor device (1) is also provided with a heating structure (40), accommodated in the housing cavity (23) and for allowing heating of the pressure detection structure (2) from the inside of the package (20).