公开(公告)号：EP3511688A1

公开(公告)日：2019-07-17

申请号：EP19152183.0

申请日：2019-01-16

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  BALDO, Lorenzo

IPC: G01L27/00 ,  G01L9/00

Abstract: A microelectromechanical pressure sensor (1) provided with: a monolithic body (2) of semiconductor material having a front surface (2a); and a sensing structure (4) integrated in the monolithic body (2) and having a buried cavity (5), completely contained within the monolithic body (2), at the front surface (2a); a sensing membrane (6), suspended above the buried cavity (5) and formed by a surface portion (2') of the monolithic body (2); and sensing elements (8), of a piezoresistive type, arranged in the sensing membrane (5) and designed to detect a deformation of the sensing membrane (5) as a result of a pressure. The pressure sensor (1) is further provided with a self-test structure (12), integrated within the monolithic body (2), wherein the sensing structure (4) is integrated, such as to cause application of a testing deformation of the sensing membrane (6) in order to verify proper operation of the sensing structure (4).

公开(公告)号：EP3276392A1

公开(公告)日：2018-01-31

申请号：EP17162626.0

申请日：2017-03-23

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  BALDO, Lorenzo ,  CARMINATI, Roberto ,  VILLA, Flavio Francesco

IPC: G02B26/08 ,  B81C1/00

Abstract: A process for manufacturing a MEMS micromirror device from a monolithic body (104) of semiconductor material. Initially, a buried cavity (106) is formed in the monolithic body and delimits at the bottom a suspended membrane (105) arranged between the buried cavity (106) and a main surface (104A) of the monolithic body (104). Then, the suspended membrane (105) is defined to form a supporting frame (115) and a mobile mass (114) rotatable about an axis (C) and carried by the supporting frame (115). The mobile mass forms an oscillating mass (107), supporting arms (109), spring portions (111), and mobile electrodes (112) combfingered to fixed electrodes (113). A reflecting region (145) is formed on top of the oscillating mass (107).

Abstract translation: 一种由半导体材料的单片体（104）制造MEMS微镜器件的方法。 最初，埋入式空腔（106）形成在整体式主体中，并且在底部限定了布置在埋入式空腔（106）与整体式主体（104）的主表面（104A）之间的悬浮膜（105）。 然后，限定悬挂膜105以形成支撑框架115和可围绕轴线C旋转并由支撑框架115承载的可移动质量块114。 可移动块形成摆动块（107），支撑臂（109），弹簧部分（111）和梳状地连接到固定电极（113）的可移动电极（112）。 反射区域（145）形成在振动块（107）的顶部上。

公开(公告)号：EP3799311A1

公开(公告)日：2021-03-31

申请号：EP20196998.7

申请日：2020-09-18

Applicant: STMicroelectronics S.r.l.

Inventor： GATTERE, Gabriele ,  VALZASINA, Carlo ,  DUQI, Enri

IPC: H03K17/975

Abstract: A button device (6) includes a MEMS sensor (30), having a MEMS strain detection structure (42) and a deformable substrate (37) configured to undergo deformation under the action of an external force (F). In particular, the MEMS strain detection structure (42) includes a mobile element (62) carried by the deformable substrate (37) via at least a first and a second anchorage (67, 69), the latter fixed with respect to the deformable substrate (37) and are configured to displace and generate a deformation force (F t ) on the mobile element (62) in the presence of the external force (F); and stator elements (70, 72) capacitively coupled to the mobile element (62). The deformation of the mobile element (62) causes a capacitance variation (ΔC) between the mobile element (62) and the stator elements (70, 72). Furthermore, the MEMS sensor (30) is configured to generate detection signals (s C1 , S C2 ; S MEMS , s ref ) correlated to the capacitance variation (ΔC).

公开(公告)号：EP3450949A1

公开(公告)日：2019-03-06

申请号：EP18188756.3

申请日：2018-08-13

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  BALDO, Lorenzo

IPC: G01L9/00

Abstract: Microelectromechanical transducer (1; 11) comprising a semiconductor body (2), four cavities (4a-4d) buried within the semiconductor body (2) and four membranes (5a-5d), each membrane (5a-5d) being suspended over a respective cavity (4a-4d) and being capable of being deflected by the action of a pressure external to the microelectromechanical transducer (1; 11); the microelectromechanical transducer (1; 11) further comprising four transducer elements (6a-6d; 16a-16d) housed by a respective membrane (5a-5d) and electrically coupled to one another in a Wheatstone bridge configuration to convert said external pressure into an electrical signal.

公开(公告)号：EP3326964A1

公开(公告)日：2018-05-30

申请号：EP17172106.1

申请日：2017-05-20

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  BALDO, Lorenzo ,  GIUSTI, Domenico

IPC: B81C1/00

CPC classification number: B81C1/00238 ,  B81B7/0051 ,  B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2201/0133 ,  B81C2203/032 ,  B81C2203/035 ,  B81C2203/0792

Abstract: Described herein is an integrated device (1), having: a first die (2); a second die (6) coupled in a stacked way on the first die (2) along a vertical axis (z); a coupling region (16) arranged between facing surfaces (2a, 6a) of the first die (2) and of the second die (6), which face one another along the vertical axis (z) and lie in a horizontal plane (xy) orthogonal to the vertical axis (z), for mechanical coupling of the first and second dies; electrical-contact elements (17) carried by the facing surfaces (2a, 6a) of the first and second dies, aligned in pairs along the vertical axis (z); and conductive regions (18) arranged between the pairs of electrical-contact elements (17) carried by the facing surfaces (2a, 6a) of the first and second dies, for their electrical coupling. Supporting elements (20) are arranged at the facing surface (2a; 6a) of at least one between the first and second dies and elastically support respective electrical-contact elements.

公开(公告)号：EP3316597A1

公开(公告)日：2018-05-02

申请号：EP17172103.8

申请日：2017-05-20

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  AZPEITIA URQUIA, Mikel ,  BALDO, Lorenzo

IPC: H04R19/00 ,  H04R19/04

CPC classification number: B81B3/0021 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/00158 ,  B81C1/00269 ,  H04R19/005 ,  H04R19/04

Abstract: Method of manufacturing a transducer module (10), comprising the steps of: forming, on a substrate (1), a first MEMS transducer (20), in particular a gyroscope, and a second MEMS transducer (30), in particular an accelerometer, having a suspended membrane (4a); forming, on the substrate (1), a conductive layer (4) and defining the conductive layer (4) in order to provide, simultaneously, at least one conductive strip (4c; 4d) electrically coupled to the first MEMS transducer (20) and the membrane (4a) of the second MEMS transducer (30).

Abstract translation: 一种制造换能器模块（10）的方法，包括以下步骤：在衬底（1）上形成第一MEMS换能器（20），特别是陀螺仪和第二MEMS换能器（30），特别是加速度计 ，具有悬浮膜（4a）; 在衬底（1）上形成导电层（4）并限定导电层（4），以便同时提供电耦合到第一MEMS换能器（20）的至少一个导电条（4c; 4d） 和第二MEMS换能器（30）的膜（4a）。

公开(公告)号：EP3210934A1

公开(公告)日：2017-08-30

申请号：EP16194672.8

申请日：2016-10-19

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  CONTI, Sebastiano ,  BALDO, Lorenzo ,  VILLA, Flavio Francesco

IPC: B81B3/00

CPC classification number: B81B7/0038 ,  B81B3/0086 ,  B81B7/0019 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/00269

Abstract: A micro-electro-mechanical pressure sensor device (100), formed by a cap region (102) and by a sensor region (101) of semiconductor material. An air gap (107) extends between the sensor region (101) and the cap region (102; 103); a buried cavity (109) extends underneath the air gap, in the sensor region (101), and delimits a membrane (111) at the bottom. A through trench (110) extends within the sensor region (101) and laterally delimits a sensitive portion (121) housing the membrane, a supporting portion (120), and a spring portion (122), the spring portion connecting the sensitive portion (121) to the supporting portion (120). A channel (123) extends within the spring portion (122) and connects the buried cavity (109) to a face (101A) of the second region (101). The first air gap (107) is fluidically connected to the outside of the device, and the buried cavity (109) is isolated from the outside via a sealing region (106B) arranged between the sensor region (101) and the cap region (102).

Abstract translation: 一种微电子机械压力传感器装置（100），其由帽区（102）和半导体材料的传感器区域（101）形成。 气隙（107）在传感器区域（101）和盖区域（102; 103）之间延伸; 埋入空腔（109）在传感器区域（101）中的气隙下方延伸，并在底部界定膜（111）。 贯穿沟槽（110）在传感器区域（101）内延伸并横向限定容纳薄膜的敏感部分（121），支撑部分（120）和弹簧部分（122），弹簧部分连接敏感部分 121）连接到支撑部分（120）。 通道（123）在弹簧部分（122）内延伸并且将掩埋腔（109）连接到第二区域（101）的面（101A）。 第一气隙107流体连接到装置的外部，并且掩埋腔109经由布置在传感器区域101和帽区域102之间的密封区域106B与外部隔离。 ）。

公开(公告)号：EP4361625A1

公开(公告)日：2024-05-01

申请号：EP23202590.8

申请日：2023-10-10

Applicant: STMicroelectronics S.r.l.

Inventor： GIUSTI, Domenico ,  DEL SARTO, Marco ,  QUAGLIA, Fabio ,  DUQI, Enri

IPC: G01N29/04 ,  G01N29/07 ,  G01N29/11

CPC classification number: G01N29/043 ,  G01N29/07 ,  G01N29/11 ,  G01N2291/269720130101 ,  G01N2291/025820130101 ,  G01N2291/04420130101 ,  G01N2291/10120130101 ,  G01N2291/10620130101

Abstract: An integrated electronic system (1) is provided with a package (2) formed by a support base (4) and a coating region (5) arranged on the support base (4) and having at least a first system die (6), including semiconductor material, coupled to the support base (4) and arranged in the coating region (5). The integrated electronic system also has, within the package (2), a monitoring system (14) configured to determine the onset of defects within the coating region (5), through the emission of acoustic detection waves and the acquisition of corresponding received acoustic waves, whose characteristics are affected by, and therefore are indicative of, the aforementioned defects.

公开(公告)号：EP4276056A9

公开(公告)日：2023-12-27

申请号：EP23170279.6

申请日：2023-04-27

Applicant: STMicroelectronics S.r.l.

Inventor： DANIELE, Filippo ,  BALDO, Lorenzo ,  MAERNA, Davide ,  DUQI, Enri

IPC: B81B7/00

Abstract: A microelectromechanical device includes a support structure (3, 5), a microelectromechanical system die (7), incorporating a microstructure (12) and a connection structure (13) between the microelectromechanical system die (7) and the support structure (3, 5). The connection structure (13) includes a spacer structure (15), joined to the support structure (3, 5), and a film (16) applied to one face of the spacer structure (15) opposite to the support structure (3, 5). The spacer structure (15) laterally delimits at least in part a cavity (18) and the film (16) extends on the cavity (18), at a distance from the support structure (3, 5). The microelectromechanical system die (7) is joined to the film (16) on the cavity (18).

公开(公告)号：EP4276056A1

公开(公告)日：2023-11-15

申请号：EP23170279.6

申请日：2023-04-27

Applicant: STMicroelectronics S.r.l.

Inventor： DANIELE, Filippo ,  BALDO, Lorenzo ,  MAERNA, Davide ,  DUQI, Enri

IPC: B81B7/00

Abstract: A microelectromechanical device includes a support structure (3, 5), a microelectromechanical system die (7), incorporating a microstructure (12) and a connection structure (13) between the microelectromechanical system die (7) and the support structure (3, 5). The connection structure (13) includes a spacer structure (15), joined to the support structure (3, 5), and a film (16) applied to one face of the spacer structure (15) opposite to the support structure (3, 5). The spacer structure (15) laterally delimits at least in part a cavity (18) and the film (16) extends on the cavity (18), at a distance from the support structure (3, 5). The microelectromechanical system die (7) is joined to the film (16) on the cavity (18).