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1.Multiple-metal-level integrated device and fabrication process thereof 失效
Title translation: 与多层金属化和制造工艺集成部件公开(公告)号:EP0631314B1
公开(公告)日:1998-09-16
申请号:EP93830277.5
申请日:1993-06-28
Applicant: STMicroelectronics S.r.l.
Inventor: Caprile, Candida , De Santi, Giorgio
IPC: H01L23/485 , H01L23/60 , H01L21/60
CPC classification number: H01L24/05 , H01L23/5226 , H01L2224/02166 , H01L2224/05093 , H01L2224/05556 , H01L2224/05624 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/19041