公开(公告)号：EP4239304A1

公开(公告)日：2023-09-06

申请号：EP23154638.3

申请日：2023-02-02

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  DANIELE, Filippo ,  BALDO, Lorenzo ,  CAPELLI, Giulio ,  ALONGI, Salvatore

IPC: G01L19/04 ,  G01L19/14 ,  G01L9/00

Abstract: A pressure sensor device (1) is provided with: a pressure detection structure (2) made in a first die (4) of semiconductor material; a package (20), configured to internally accommodate the pressure detection structure (2) in an impermeable manner, the package (20) having a base structure (21) and a body structure (22), arranged on the base structure (21), with an access opening (30) in contact with an external environment and internally defining a housing cavity (23), in which the first die (4) is arranged covered with a coating material (32). The pressure sensor device (1) is also provided with a heating structure (40), accommodated in the housing cavity (23) and for allowing heating of the pressure detection structure (2) from the inside of the package (20).

公开(公告)号：EP4276056A9

公开(公告)日：2023-12-27

申请号：EP23170279.6

申请日：2023-04-27

Applicant: STMicroelectronics S.r.l.

Inventor： DANIELE, Filippo ,  BALDO, Lorenzo ,  MAERNA, Davide ,  DUQI, Enri

IPC: B81B7/00

Abstract: A microelectromechanical device includes a support structure (3, 5), a microelectromechanical system die (7), incorporating a microstructure (12) and a connection structure (13) between the microelectromechanical system die (7) and the support structure (3, 5). The connection structure (13) includes a spacer structure (15), joined to the support structure (3, 5), and a film (16) applied to one face of the spacer structure (15) opposite to the support structure (3, 5). The spacer structure (15) laterally delimits at least in part a cavity (18) and the film (16) extends on the cavity (18), at a distance from the support structure (3, 5). The microelectromechanical system die (7) is joined to the film (16) on the cavity (18).

公开(公告)号：EP4276056A1

公开(公告)日：2023-11-15

申请号：EP23170279.6

申请日：2023-04-27

Applicant: STMicroelectronics S.r.l.

Inventor： DANIELE, Filippo ,  BALDO, Lorenzo ,  MAERNA, Davide ,  DUQI, Enri

IPC: B81B7/00

Abstract: A microelectromechanical device includes a support structure (3, 5), a microelectromechanical system die (7), incorporating a microstructure (12) and a connection structure (13) between the microelectromechanical system die (7) and the support structure (3, 5). The connection structure (13) includes a spacer structure (15), joined to the support structure (3, 5), and a film (16) applied to one face of the spacer structure (15) opposite to the support structure (3, 5). The spacer structure (15) laterally delimits at least in part a cavity (18) and the film (16) extends on the cavity (18), at a distance from the support structure (3, 5). The microelectromechanical system die (7) is joined to the film (16) on the cavity (18).