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1.Contact structure and corresponding manufacturing method for EPROM or flash EPROM semiconductor electronic devices 失效
Title translation: 接触结构用于电子EPROM或闪存EPROM半导体电路及其制造方法公开(公告)号:EP0851493B1
公开(公告)日:2006-11-29
申请号:EP96830655.5
申请日:1996-12-27
Applicant: STMicroelectronics S.r.l.
IPC: H01L27/00 , H01L21/768
CPC classification number: H01L21/76897 , H01L21/76838 , H01L2924/3011
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2.Contact structure and corresponding manufacturing method for EPROM or flash EPROM semiconductor electronic devices 失效
Title translation: 接触结构用于电子EPROM或闪存EPROM半导体电路及其制造方法公开(公告)号:EP0851493B9
公开(公告)日:2007-09-12
申请号:EP96830655.5
申请日:1996-12-27
Applicant: STMicroelectronics S.r.l.
IPC: H01L27/00 , H01L21/768
CPC classification number: H01L21/76897 , H01L21/76838 , H01L2924/3011
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