Abstract:
A MEMS angular rate sensor is presented with two pairs of suspended masses that are micromachined on a semiconductor layer. A first pair includes two masses opposite to and in mirror image of each other. The first pair of masses has driving structures to generate a mechanical oscillation in a linear direction. A second pair of masses includes two masses opposite to and in mirror image of each other. The second pair of masses is coupled to the first pair of driving masses with coupling elements. The two pairs of masses are coupled to a central bridge. The central bridge has a differential configuration to reject any external disturbances. Each of the masses of the two pairs of masses includes different portions to detect different linear and angular movements.
Abstract:
A method for manufacturing a Coriolis-force-based flow sensing device (1), comprising the steps of: forming a driving electrode (6b; 6c); forming, on the driving electrode (6b; 6c), a first sacrificial region (21); forming, on the first sacrificial region, a first structural portion with a second sacrificial region (28) buried therein; forming openings for selectively etching the second sacrificial region (28); forming, within the openings, a porous layer (34) having pores; removing the second sacrificial region (28) through the pores of the porous layer, forming a buried channel (4); growing, on the porous layer and not within the buried channel, a second structural portion that forms, with the first structural region, a structural body (5); selectively removing the first sacrificial region (21) thus suspending the structural body on the driving electrode.
Abstract:
A MEMS shutter including: a substrate (2) of semiconductor material traversed by a main aperture (9), and a first semiconductor layer (14) and a second semiconductor layer (16), which form a supporting structure (28, 71) fixed to the substrate; a plurality of deformable structures (29, 59, 69); a plurality of actuators (36; 96); and a plurality of shielding structures (33; 35; 333; 335; 433), each of which is formed by a corresponding portion of at least one between the first semiconductor layer and the second semiconductor layer, the shielding structures being arranged angularly around the underlying main aperture so as to provide shielding of the main aperture, each shielding structure being further coupled to the supporting structure via a corresponding deformable structure. Each actuator may be controlled so as to cause a rotation of a corresponding shielding structure between a respective first position and a respective second position, thus varying shielding of the main aperture. The first and second positions of the shielding structures are such that, in at least one operating condition of the MEMS shutter (1), pairs of adjacent shielding structures at least partially overlap one another.
Abstract:
A MEMS shutter (1) including: a semiconductor substrate (2) traversed by an aperture (9); a first semiconductor layer (14) and a second semiconductor layer (16), which form a supporting structure (28, 71, 87; 28, 171) fixed to the substrate; a plurality of deformable structures (29, 59, 68, 85; 169), each of which is formed by a corresponding portion of at least one between the first and second semiconductor layers; a plurality of actuators (36; 96); a plurality of shielding structures (33; 35; 333; 335; 433), each of which is formed by a corresponding portion of at least one between the first and second semiconductor layers, the shielding structures being arranged angularly around the underlying aperture so as to provide shielding of the aperture, each shielding structure being further coupled to the supporting structure via a deformable structure. Each actuator may be controlled so as to translate a corresponding shielding structure between a first position and a second position, thus varying shielding of the aperture; the first and second positions of the shielding structures are such that, in at least one operating condition, pairs of adjacent shielding structures at least partially overlap one another.
Abstract:
A microelectromechanical gyroscope (10) with detection along a vertical axis is provided with a detection structure (10) having a movable structure (12), suspended above a substrate (13) so as to perform, as a function of an angular velocity (Ωz) around the vertical axis a sense movement along a first horizontal axis (x). The movable structure has at least one drive mass (14) internally defining a window (16), elastically coupled to a rotor anchor (20'), at an anchoring region (A), through elastic anchoring elements (21); at least one bridge element (18), rigid and of a conductive material, cantilevered suspended and extending within the window along the first horizontal axis, elastically coupled to the drive mass; movable electrodes (23), carried integrally by the bridge element with extension along a second horizontal axis (y). The detection structure (10) also has stator electrodes (28, 29), arranged in the window and interdigitated with the movable electrodes, at a certain separation distance below the bridge element (18), which extends longitudinally above the same stator electrodes and the movable electrodes.
Abstract:
A gyroscopic sensor unit (101) detects a phase drift between a demodulated output signal and a demodulation signal during output of a quadrature test signal. A delay calculator (116) detects the phase drift based on changes in the demodulated output signal during application of the quadrature test signal. A delay compensation circuit (118) compensates for the phase drift by delaying the demodulation signal by the phase drift value.
Abstract:
A microelectromechanical gyroscope includes: the support structure (6); a sensing mass (3), coupled to the support structure (6) with degrees of freedom along a driving direction (DD) and a sensing direction (DS) perpendicular to each other; and a calibration structure (5) facing the sensing mass (3) and separated from the sensing mass (3) by a gap (21) having an average width (W), the calibration structure (5) being movable with respect to the sensing mass (3) so that displacements of the calibration structure (5) cause variations in the average width (W) of the gap (21) . A calibration actuator (20, 30) controls a relative position of the calibration structure (5) with respect to the sensing mass (3) and the average width (W) of the gap (21).
Abstract:
An encapsulated device of semiconductor material wherein a chip (56) of semiconductor material is fixed to a base element (52) of a packaging body (51) through at least one pillar element (60) having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements (60) are fixed in proximity of the corners of a fixing surface (56A) of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.
Abstract:
A microelectromechanical gyroscope (10) is provided with a detection structure (11) having: a substrate (14) with a top surface (14a) parallel to a horizontal plane (xy); a mobile mass (12), suspended above the substrate to perform, as a function of a first angular velocity (Ω x ) around a first axis (x) of the horizontal plane (xy), at least a first detection movement of rotation around a second axis (y) of the horizontal plane; and a first and a second stator elements (28a, 28b) integral with the substrate and arranged underneath the mobile mass to define a capacitive coupling, a capacitance value thereof is indicative of the first angular velocity (Ω x ). The detection structure has a single mechanical anchorage structure for anchoring both the mobile mass and the stator elements to the substrate, arranged internally with respect to the mobile mass, which is coupled to this single mechanical anchorage structure by coupling elastic elements (18) yielding to torsion around the second axis; the stator elements are integrally coupled to the single mechanical anchorage structure in an arrangement suspended above the top surface of the substrate.
Abstract:
A microelectromechanical device includes a substrate (21), a first structural layer (23), and a second structural layer (25) of semiconductor material. A sensing mass (32; 132) extends in the first structural layer (23) and is coupled to the substrate (21) by first elastic connections (35) that oscillate in a sensing direction (Z) perpendicular to the substrate (21), with a maximum elongation with respect to a resting position. An out-of-plane stopper structure (38) includes an anchorage (39) fixed to the substrate (21) and a mechanical end-of-travel structure (40), which extends in the second structural layer (25), faces the sensing mass (32), and is separated therefrom by a gap (41) having a width (W) smaller than the maximum elongation. The mechanical end-of-travel structure (40) is coupled to the anchorage (39) by second elastic connections (42) that enable shifts of the mechanical end-of-travel structure (40) with respect to the sensing direction (Z) in response to an impact of the sensing mass (32).