公开(公告)号：EP4108462A1

公开(公告)日：2022-12-28

申请号：EP22179954.7

申请日：2022-06-20

Applicant: STMicroelectronics S.r.l.

Inventor： GIUSTI, Domenico ,  GULLI', Gianluca ,  FERRARIO, Francesco ,  MAERNA, Davide ,  TENTORI, Lorenzo

IPC: B41J2/14 ,  B41J2/16 ,  B05B1/24 ,  B05B1/14

Abstract: A microfluidic device (1) has a chamber (17); a fluidic access channel (20) in fluidic connection with the chamber; a plurality of nozzle apertures (34) in fluidic connection with the chamber; and an actuator (18), operatively coupled to the fluid containment chamber and configured to cause ejection of drops of fluid through the nozzle apertures in an operating condition of the microfluidic device. The chamber (17) has an elongated shape, with a length and a maximum width, wherein an aspect ratio between the length and the maximum width of the chamber is at least 3:1. The nozzle apertures (34) are configured to generate, in use, a plurality of drops having a total drop volume, wherein a ratio total drop volume to a chamber volume is at least 15%.

公开(公告)号：EP4276056A9

公开(公告)日：2023-12-27

申请号：EP23170279.6

申请日：2023-04-27

Applicant: STMicroelectronics S.r.l.

Inventor： DANIELE, Filippo ,  BALDO, Lorenzo ,  MAERNA, Davide ,  DUQI, Enri

IPC: B81B7/00

Abstract: A microelectromechanical device includes a support structure (3, 5), a microelectromechanical system die (7), incorporating a microstructure (12) and a connection structure (13) between the microelectromechanical system die (7) and the support structure (3, 5). The connection structure (13) includes a spacer structure (15), joined to the support structure (3, 5), and a film (16) applied to one face of the spacer structure (15) opposite to the support structure (3, 5). The spacer structure (15) laterally delimits at least in part a cavity (18) and the film (16) extends on the cavity (18), at a distance from the support structure (3, 5). The microelectromechanical system die (7) is joined to the film (16) on the cavity (18).

公开(公告)号：EP4276056A1

公开(公告)日：2023-11-15

申请号：EP23170279.6

申请日：2023-04-27

Applicant: STMicroelectronics S.r.l.

Inventor： DANIELE, Filippo ,  BALDO, Lorenzo ,  MAERNA, Davide ,  DUQI, Enri

IPC: B81B7/00

Abstract: A microelectromechanical device includes a support structure (3, 5), a microelectromechanical system die (7), incorporating a microstructure (12) and a connection structure (13) between the microelectromechanical system die (7) and the support structure (3, 5). The connection structure (13) includes a spacer structure (15), joined to the support structure (3, 5), and a film (16) applied to one face of the spacer structure (15) opposite to the support structure (3, 5). The spacer structure (15) laterally delimits at least in part a cavity (18) and the film (16) extends on the cavity (18), at a distance from the support structure (3, 5). The microelectromechanical system die (7) is joined to the film (16) on the cavity (18).